Hebei Sinopack Electronic Technology Co.,Ltd.

Shenzhen Stock Exchange 003031.SZ

Hebei Sinopack Electronic Technology Co.,Ltd. Current Liabilities for the year ending December 31, 2023: USD 149.84 M

Hebei Sinopack Electronic Technology Co.,Ltd. Current Liabilities is USD 149.84 M for the year ending December 31, 2023, a 123.71% change year over year. Current liabilities are obligations that are expected to be settled within one year, including accounts payable, short-term debt, and other current liabilities.

Hebei Sinopack Electronic Technology Co.,Ltd. Current Liabilities for the year ending December 31, 2022 was USD 66.98 M, a 20.10% change year over year.
Hebei Sinopack Electronic Technology Co.,Ltd. Current Liabilities for the year ending December 31, 2021 was USD 55.77 M, a 9.33% change year over year.
Hebei Sinopack Electronic Technology Co.,Ltd. Current Liabilities for the year ending December 31, 2020 was USD 51.01 M, a 79.12% change year over year.
Hebei Sinopack Electronic Technology Co.,Ltd. Current Liabilities for the year ending December 31, 2019 was USD 28.48 M, a 19.12% change year over year.

Key data

Date	Current Liabilities	Total Non-Current Liabilities	Shareholders' Equity	Long-Term Debt

Shenzhen Stock Exchange: 003031.SZ

Hebei Sinopack Electronic Technology Co.,Ltd.

CEO	Mr. Hualiang Fu
IPO Date	Jan. 4, 2021
Location	China
Headquarters	No. 21, Changsheng Street
Employees	487
Sector	Materials
Industries Ceramics Chemicals & Advanced Materials Consumer Packaged Goods

Description

Hebei Sinopack Electronic Technology Co.,Ltd. develops, produces, and sells multi-layer ceramic packaging products. The company offers electronic ceramic products for use in the areas of optical communication, industrial laser, infrared detector, microwave communication, automotive electronics, and consumer electronics. It also engages in the import and export business; and the provision of technical consulting services. The company was founded in 2009 and is based in Luquan, China.

Key trends

Past 5 years