EO Technics Co., Ltd.

KOSDAQ 039030.KQ

EO Technics Co., Ltd. Debt to Equity Ratio for the year ending December 31, 2023: 0.02

EO Technics Co., Ltd. Debt to Equity Ratio is 0.02 for the year ending December 31, 2023, a -29.86% change year over year. Debt to equity ratio represents the financing from debt versus equity. Higher ratio indicates more debt reliance, suggesting potential risk.
  • EO Technics Co., Ltd. Debt to Equity Ratio for the year ending December 31, 2022 was 0.02, a -10.54% change year over year.
  • EO Technics Co., Ltd. Debt to Equity Ratio for the year ending December 31, 2021 was 0.03, a -11.62% change year over year.
  • EO Technics Co., Ltd. Debt to Equity Ratio for the year ending December 31, 2020 was 0.03, a -16.61% change year over year.
  • EO Technics Co., Ltd. Debt to Equity Ratio for the year ending December 31, 2019 was 0.04, a -53.10% change year over year.
Key data
Date Debt to Equity Ratio Debt to Income Ratio Debt to Tangible Net Worth Ratio Dividend Coverage Ratio
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KOSDAQ: 039030.KQ

EO Technics Co., Ltd.

CEO Mr. Kyu-Dong Sung
IPO Date Sept. 14, 2000
Location South Korea
Headquarters 91 Dongpyeonro
Employees 608
Sector Technology
Industries
Description

EO Technics Co., Ltd. manufactures and supplies laser processing equipment worldwide. The company offers semiconductor products comprising strip markers, strip and boat carrier markers, tray markers, wafer markers, and ID card markers; grooving and dicing products; cutting equipment for singulation of PCB panels and various strips; drilling equipment for the strip and wafer types; IGBT/wafer annealing equipment; and wafer cleaning equipment for integrated micro circuit processes. It also provides display products, such as LCD markers, align key markers, OLED/TFT/CF trimmers, metal sheet cutters, pol. film cutters, film cutters, mask repair equipment, TFT titlers, edge exposure equipment, laser lift off and chamfer cut products, green laser annealing products, window glass cutters, laser patterning products, PV markers, and laser edge isolation and laser ablation/doping products; PCB equipment for drilling, marking, and cutting applications; macro equipment for use in marking, welding, soldering, cutting, and bonding applications; and laser equipment. The company was founded in 1989 and is based in Anyang-si, South Korea.

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StockViz Staff

January 15, 2025

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