Xingye Alloy Materials Group Limited
HKSE 0505.HK
Xingye Alloy Materials Group Limited Total Non-Current Liabilities for the year ending December 31, 2023: USD 27.29 M
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Xingye Alloy Materials Group Limited Total Non-Current Liabilities for the year ending December 31, 2022 was USD 23.70 M, a 76.18% change year over year.
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Xingye Alloy Materials Group Limited Total Non-Current Liabilities for the year ending December 31, 2021 was USD 13.45 M, a -33.51% change year over year.
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Xingye Alloy Materials Group Limited Total Non-Current Liabilities for the year ending December 31, 2020 was USD 20.23 M, a 16.07% change year over year.
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Xingye Alloy Materials Group Limited Total Non-Current Liabilities for the year ending December 31, 2019 was USD 17.43 M, a 26.58% change year over year.
| Date | Total Non-Current Liabilities | Shareholders' Equity | Other Liabilities | Total Liabilities |
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Don’t Miss A Beat
| CEO | Mr. Minglie Hu |
| IPO Date | Dec. 27, 2007 |
| Location | Hong Kong |
| Headquarters | Hung Tai Industrial Building |
| Employees | 1,706 |
| Sector | Materials |
| Industries | |
Xingye Alloy Materials Group Limited manufactures, sells, and trades in high precision copper plates and strips in Mainland China, Taiwan, Hong Kong, Singapore, Bangladesh, Thailand, India, and internationally. The company engages in the trading of raw materials; provision of processing services; and management of a portfolio of investment and development, operation, and distribution of internet and mobile gaming products. The company was formerly known as Huan Yue Interactive Holdings Limited and changed its name to Xingye Alloy Materials Group Limited in July 2020. Xingye Alloy Materials Group Limited was founded in 1985 and is headquartered in Kowloon, Hong Kong.
Past 5 years
StockViz Staff
February 3, 2025
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