Shanghai Fudan Microelectronics Group Company Limited

HKSE 1385.HK

Shanghai Fudan Microelectronics Group Company Limited Current Liabilities for the year ending December 31, 2023: USD 264.70 M

Shanghai Fudan Microelectronics Group Company Limited Current Liabilities is USD 264.70 M for the year ending December 31, 2023, a 102.09% change year over year. Current liabilities are obligations that are expected to be settled within one year, including accounts payable, short-term debt, and other current liabilities.
  • Shanghai Fudan Microelectronics Group Company Limited Current Liabilities for the year ending December 31, 2022 was USD 130.98 M, a 16.70% change year over year.
  • Shanghai Fudan Microelectronics Group Company Limited Current Liabilities for the year ending December 31, 2021 was USD 112.24 M, a 53.37% change year over year.
  • Shanghai Fudan Microelectronics Group Company Limited Current Liabilities for the year ending December 31, 2020 was USD 73.18 M, a 16.63% change year over year.
  • Shanghai Fudan Microelectronics Group Company Limited Current Liabilities for the year ending December 31, 2019 was USD 62.75 M, a 3.45% change year over year.
Key data
Date Current Liabilities Total Non-Current Liabilities Shareholders' Equity Long-Term Debt
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SV Wall Street
HKSE: 1385.HK

Shanghai Fudan Microelectronics Group Company Limited

CEO Mr. Guoxing Jiang
IPO Date Aug. 4, 2000
Location China
Headquarters Building 4
Employees 2,045
Sector Technology
Industries
Description

Shanghai Fudan Microelectronics Group Company Limited designs, develops, and sells integrated circuit products and integrated circuit product testing services in Mainland China and internationally. It offers security and identification products, including sensors, contact and contactless memory ICs, HF RFID and NFC tag ICs, NFC channel ICs, contactless CPU cards, chips, contact dual interface, CPU card chips, secured encryption chips, and HF reader chips. The company also provides smart meters ASIC chips, ultra-low general-purpose MCU, and ePLC solutions; NVM products, such as EEPROM, SPI NOR flash, SPI and parallel NAND flash, and ASNVM; and specific analog circuits. In addition, it offers bank cards, smart meters, social security cards, smart transportation cards, and ePLC solutions; and issuance and validation services. Further, the company provides chip testing services and products. The company was formerly known as Shanghai Fudan Microelectronics Company Limited. Shanghai Fudan Microelectronics Group Company Limited was incorporated in 1998 and is headquartered in Shanghai, the People's Republic of China.

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StockViz Staff

January 31, 2025

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