WUS Printed Circuit Co., Ltd.

Taiwan Stock Exchange 2316.TW

WUS Printed Circuit Co., Ltd. Debt to Equity Ratio for the year ending December 31, 2023: 0.40

WUS Printed Circuit Co., Ltd. Debt to Equity Ratio is 0.40 for the year ending December 31, 2023, a 5.30% change year over year. Debt to equity ratio represents the financing from debt versus equity. Higher ratio indicates more debt reliance, suggesting potential risk.

WUS Printed Circuit Co., Ltd. Debt to Equity Ratio for the year ending December 31, 2022 was 0.38, a -20.22% change year over year.
WUS Printed Circuit Co., Ltd. Debt to Equity Ratio for the year ending December 31, 2021 was 0.47, a 37.77% change year over year.
WUS Printed Circuit Co., Ltd. Debt to Equity Ratio for the year ending December 31, 2020 was 0.34, a -9.48% change year over year.
WUS Printed Circuit Co., Ltd. Debt to Equity Ratio for the year ending December 31, 2019 was 0.38, a 5.92% change year over year.

Key data

Date	Debt to Equity Ratio	Debt to Income Ratio	Debt to Tangible Net Worth Ratio	Dividend Coverage Ratio

Taiwan Stock Exchange: 2316.TW

WUS Printed Circuit Co., Ltd.

CEO	Mr. Chih-Kang Chen
IPO Date	Jan. 4, 2000
Location	Taiwan
Headquarters	No. 37 Kai Fa Road
Employees	1,633
Sector	Technology
Industries Hardware & Electronics Semiconductors

Description

WUS Printed Circuit Co., Ltd. manufactures and sells various printed circuit boards in Taiwan. The company offers multilayer and mobile phones boards. It also provides communication RF modules, embedded passives, and high-density microvia (HDI) products. Its products are used in add-on cards, motherboards, telecom products, radio base stations, mobile phones, digital cameras, notebooks, and other digital and entertainment products. The company was founded in 1972 and is based in Kaohsiung, Taiwan.

Key trends

Past 5 years