Winbond Electronics Corporation
Sector
Location
Market Cap
USD 2.72 B
Share Price
USD 0.60
Avg Daily Volume
65,964,504
Change (1 day)
Change (1 year)
Change (YTD)
QUALCOMM Incorporated
USD 156.59
QCOM
Arm Holdings plc American Depositary Shares
USD 141.60
ARM
Intel Corporation
USD 22.22
INTC
Hon Hai Precision Industry Co., Ltd.
USD 6.61
2317.TW
MediaTek Inc.
USD 46.41
2454.TW
Marvell Technology, Inc.
USD 79.32
MRVL
Infineon Technologies AG
USD 42.86
IFX.DE
NXP Semiconductors N.V.
USD 230.52
NXPI
Yageo Corporation
USD 18.20
2327.TW
Microchip Technology Incorporated
USD 65.75
MCHP
Murata Manufacturing Co., Ltd.
USD 16.31
6981.T
Renesas Electronics Corporation
USD 12.39
6723.T
BOE Technology Group Company Limited
USD 0.55
000725.SZ
ON Semiconductor Corporation
USD 51.89
ON
GigaDevice Semiconductor (Beijing) Inc.
USD 17.18
603986.SS
Date | Operating Cash Flow | Capital Expenditure | Net Cash Used For Investing Activities | Net Cash Used Provided By Financing Activities |
---|
QUALCOMM Incorporated
USD 156.59
QCOM
Arm Holdings plc American Depositary Shares
USD 141.60
ARM
Intel Corporation
USD 22.22
INTC
Hon Hai Precision Industry Co., Ltd.
USD 6.61
2317.TW
MediaTek Inc.
USD 46.41
2454.TW
Marvell Technology, Inc.
USD 79.32
MRVL
Infineon Technologies AG
USD 42.86
IFX.DE
NXP Semiconductors N.V.
USD 230.52
NXPI
Yageo Corporation
USD 18.20
2327.TW
Microchip Technology Incorporated
USD 65.75
MCHP
Murata Manufacturing Co., Ltd.
USD 16.31
6981.T
Renesas Electronics Corporation
USD 12.39
6723.T
BOE Technology Group Company Limited
USD 0.55
000725.SZ
ON Semiconductor Corporation
USD 51.89
ON
GigaDevice Semiconductor (Beijing) Inc.
USD 17.18
603986.SS