Mospec Semiconductor Corp.

Taiwan Stock Exchange 2434.TW

Mospec Semiconductor Corp. Interest Coverage Ratio for the year ending December 31, 2023: -9.19

Mospec Semiconductor Corp. Interest Coverage Ratio is -9.19 for the year ending December 31, 2023, a 31.96% change year over year. Interest coverage ratio assesses earnings' ability to cover interest expenses; higher ratios signal lower risk.
  • Mospec Semiconductor Corp. Interest Coverage Ratio for the year ending December 31, 2022 was -13.51, a 34.73% change year over year.
  • Mospec Semiconductor Corp. Interest Coverage Ratio for the year ending December 31, 2021 was -20.70, a -15,662.23% change year over year.
  • Mospec Semiconductor Corp. Interest Coverage Ratio for the year ending December 31, 2020 was -0.13, a 99.66% change year over year.
  • Mospec Semiconductor Corp. Interest Coverage Ratio for the year ending December 31, 2019 was -38.26, a -41.94% change year over year.
Key data
Date Interest Coverage Ratio Debt to Equity Ratio Interest Expense To Sales Inventory Turnover Ratio
Market news
SV Wall Street
Taiwan Stock Exchange: 2434.TW

Mospec Semiconductor Corp.

CEO Bennet-Yun Tang
IPO Date Jan. 4, 2000
Location Taiwan
Headquarters No. 76, Zhongshan Road
Employees 457
Sector Technology
Industries
Hardware & Electronics 3D Printing Automobiles & Vehicles Automotive Parts Ceramics Electric Vehicles (EVs) Lithium Semiconductors Solar Energy
Description

Mospec Semiconductor Corp. operates as an integrated power semiconductor company in Taiwan. It provides solar cells, epitaxial silicon wafers, polished prime wafers, and wafer reclamation products, as well as surface mount devices. The company also offers discrete components, such as Schottky barrier rectifiers, transient voltage suppressor and small signal Schottky diodes, and mini dip bridges, as well as fast recovery, ultra-fast, and high efficiency rectifier diodes; and power transistors, such as Darlington and switching transistors. In addition, it provides foundry services for silicon epitaxy, wafer fabrication, and semiconductor packaging. The company was founded in 1976 and is headquartered in Tainan City, Taiwan.

StockViz Staff

February 5, 2025

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