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Tecnisco, Ltd.

Tokyo Stock Exchange:2962.T

Location

Japan

Market Cap

USD 19.89 M

Share Price

USD 2.17

Avg Daily Volume

74,775

Change (1 day)

5.33%

Change (1 year)

Change (YTD)

33.45%

Tecnisco, Ltd. EBITDA for the year ending June 30, 2024: USD 912.14 K

Tecnisco, Ltd. EBITDA is USD 912.14 K for the year ending June 30, 2024, a -85.15% change year over year. EBITDA means earnings before interest, taxes, depreciation, and amortization, which measures a company's operating performance by excluding non-operating expenses.
  • Tecnisco, Ltd. EBITDA for the year ending June 30, 2023 was USD 6.14 M, a -42.28% change year over year.
  • Tecnisco, Ltd. EBITDA for the year ending June 30, 2022 was USD 10.64 M, a 38.82% change year over year.
  • Tecnisco, Ltd. EBITDA for the year ending June 30, 2021 was USD 7.67 M.
Key data
Date EBITDA Net Income EPS (Diluted) Shares (Diluted, Weighted)
Market news
Tokyo Stock Exchange: 2962.T

Tecnisco, Ltd.

CEO Mr. Keizo Sekiya
IPO Date July 26, 2023
Location Japan
Headquarters 2-2-15, Minami-Shinagawa
Employees 314
Sector 🤖 Technology
Industries
Hardware & Electronics
🖨 3D Printing
🔬 Chemicals & Advanced Materials
🍸 Glass
💻 Semiconductors
Description

Tecnisco, Ltd. manufactures and sells precision components for optoelectronics, electronics, and life science industries in Japan. It offers heatsinks, such as micro channel coolers, CuW sub mounts, insulation type Cu-AlN-Cu sub mounts, high pressure seamless micro channels, and mounts/carriers for optical communication, industrial lasers, power semiconductor devices, MPUs, etc. The company also provides micro-hole glass, through glass via, cavity glass/cap glass, mesh glass, spacer glass, and microfluidic glass products for projector, sensor, mobile device, semiconductor, and biotechnology/medical equipment. In addition, it offers silicon products, including CVD susceptors, rings for various equipment, focus rings, cleaning jigs, wall plates in the implantation dome, tubes, pins, and optical waveguide wafer jigs for various devices, tables, and nozzles; silicon wafers for dicing test; and drilling tool products. The company was incorporated in 1970 and is headquartered in Tokyo, Japan. Tecnisco, Ltd. operates as a subsidiary of Disco Corporation.

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