Hunan Goke Microelectronics Co.,Ltd.

Shenzhen Stock Exchange 300672.SZ

Hunan Goke Microelectronics Co.,Ltd. Dividend Per Share for the year ending December 31, 2023: USD 0.06

Hunan Goke Microelectronics Co.,Ltd. Dividend Per Share is USD 0.06 for the year ending December 31, 2023, a 9.82% change year over year. Dividend per share represents the dividends distributed per share. Indicates dividend yield potential on a per-share basis.

Hunan Goke Microelectronics Co.,Ltd. Dividend Per Share for the year ending December 31, 2022 was USD 0.06, a 14.01% change year over year.
Hunan Goke Microelectronics Co.,Ltd. Dividend Per Share for the year ending December 31, 2021 was USD 0.05, a 227.66% change year over year.
Hunan Goke Microelectronics Co.,Ltd. Dividend Per Share for the year ending December 31, 2020 was USD 0.02, a 72.69% change year over year.
Hunan Goke Microelectronics Co.,Ltd. Dividend Per Share for the year ending December 31, 2019 was USD 0.01, a -51.93% change year over year.

Key data

Date	Dividend Per Share	Free Cash Flow Per Share	Return on Assets (ROA)	Return on Equity (ROE)

Shenzhen Stock Exchange: 300672.SZ

Hunan Goke Microelectronics Co.,Ltd.

CEO	Mr. Ping Xiang
IPO Date	July 12, 2017
Location	China
Headquarters	No. 9, East 10th Road (South)
Employees	834
Sector	Technology
Industries Hardware & Electronics 3D Printing Artificial Intelligence (AI) Autonomous Driving Computers Crypto Mining Lithium Semiconductors

Description

Hunan Goke Microelectronics Co.,Ltd. engages in the research and development of integrated circuit chips in China. It offers its products for use in solid-state storage, smart monitoring, smart set-top boxes, and the Internet of Things. The company was founded in 2008 and is headquartered in Changsha, China.

Key trends

Past 5 years