Chenming Electronic Tech. Corp.

Taiwan Stock Exchange 3013.TW

Chenming Electronic Tech. Corp. Debt to Equity Ratio for the year ending December 31, 2023: 0.26

Chenming Electronic Tech. Corp. Debt to Equity Ratio is 0.26 for the year ending December 31, 2023, a -43.62% change year over year. Debt to equity ratio represents the financing from debt versus equity. Higher ratio indicates more debt reliance, suggesting potential risk.

Chenming Electronic Tech. Corp. Debt to Equity Ratio for the year ending December 31, 2022 was 0.46, a -62.17% change year over year.
Chenming Electronic Tech. Corp. Debt to Equity Ratio for the year ending December 31, 2021 was 1.21, a 207.05% change year over year.
Chenming Electronic Tech. Corp. Debt to Equity Ratio for the year ending December 31, 2020 was 0.39, a 28.96% change year over year.
Chenming Electronic Tech. Corp. Debt to Equity Ratio for the year ending December 31, 2019 was 0.30, a 9.34% change year over year.

Key data

Date	Debt to Equity Ratio	Debt to Income Ratio	Debt to Tangible Net Worth Ratio	Dividend Coverage Ratio

Taiwan Stock Exchange: 3013.TW

Chenming Electronic Tech. Corp.

CEO	Mr. Chih-Chi Lo
IPO Date	Sept. 17, 2002
Location	Taiwan
Headquarters	No. 27, Mincyuan East Road
Employees	2,112
Sector	Industrials
Industries Machinery Hardware & Electronics

Description

Chenming Electronic Tech. Corp., an OEM/ODM manufacturer, engages in the production and sale of computer and server chassis, mobile device components, and related components in Taiwan, China, Japan, the United States, and internationally. It also produces desktop, server, and notebook subsystems; clone server, metal parts, and power supplier and heat sink units; and metal injection molding products. The company was formerly known as Chenming Mold Ind. Corp. and changed its name to Chenming Electronic Technology Corporation in January 2020. Chenming Electronic Tech. Corp. was founded in 1970 and is headquartered in Taipei, Taiwan.

Key trends

Past 5 years