Sumco Corporation

Tokyo Stock Exchange 3436.T

Sumco Corporation Dividends Paid for the year ending December 31, 2023: USD -215.90 M

Sumco Corporation Dividends Paid is USD -215.90 M for the year ending December 31, 2023, a -34.78% change year over year. Dividends paid is cash paid to shareholders as a distribution of profits.

Sumco Corporation Dividends Paid for the year ending December 31, 2022 was USD -160.18 M, a -144.16% change year over year.
Sumco Corporation Dividends Paid for the year ending December 31, 2021 was USD -65.61 M, a 17.05% change year over year.
Sumco Corporation Dividends Paid for the year ending December 31, 2020 was USD -79.09 M, a 48.57% change year over year.
Sumco Corporation Dividends Paid for the year ending December 31, 2019 was USD -153.79 M, a -19.76% change year over year.

Key data

Date	Dividends Paid	Capital Expenditure	Other Financing Activities	Net Cash Used Provided By Financing Activities

Tokyo Stock Exchange: 3436.T

Sumco Corporation

CEO	Mr. Mayuki Hashimoto
IPO Date	Aug. 15, 2003
Location	Japan
Headquarters	Seavans North
Employees	9,847
Sector	Technology
Industries Semiconductors Hardware & Electronics

Description

Sumco Corporation, together with its subsidiaries, manufactures and sells silicon wafers for the semiconductor industry primarily in Japan, the United States, China, Taiwan, Korea, and internationally. It provides monocrystalline ingots, as well as polished, annealed, epitaxial, junction isolated, silicon-on-insulator, and reclaimed polished wafers. The company was formerly known as Sumitomo Mitsubishi Silicon Corp. and changed its name to Sumco Corporation in August 2005. Sumco Corporation was incorporated in 1999 and is headquartered in Tokyo, Japan.

Key trends

Past 5 years