Formosa Sumco Technology Corporation

Taiwan Stock Exchange 3532.TW

Formosa Sumco Technology Corporation Debt to Equity Ratio for the year ending December 31, 2023: 0.45

Formosa Sumco Technology Corporation Debt to Equity Ratio is 0.45 for the year ending December 31, 2023, a 22,767.57% change year over year. Debt to equity ratio represents the financing from debt versus equity. Higher ratio indicates more debt reliance, suggesting potential risk.

Formosa Sumco Technology Corporation Debt to Equity Ratio for the year ending December 31, 2022 was 0.00, a 134.72% change year over year.
Formosa Sumco Technology Corporation Debt to Equity Ratio for the year ending December 31, 2021 was 0.00, a -43.25% change year over year.
Formosa Sumco Technology Corporation Debt to Equity Ratio for the year ending December 31, 2020 was 0.00, a 83.30% change year over year.
Formosa Sumco Technology Corporation Debt to Equity Ratio for the year ending December 31, 2019 was 0.00, a 0.00% change year over year.

Key data

Date	Debt to Equity Ratio	Debt to Income Ratio	Debt to Tangible Net Worth Ratio	Dividend Coverage Ratio

Taiwan Stock Exchange: 3532.TW

Formosa Sumco Technology Corporation

CEO	Mr. Wen-Bee Kuo
IPO Date	Dec. 10, 2007
Location	Taiwan
Headquarters	No.1-1, Formosa Industrial Park
Employees	1,452
Sector	Technology
Industries Hardware & Electronics Ceramics Glass Semiconductors

Description

Formosa Sumco Technology Corporation manufactures, sells, and trades in silicon wafer semiconductors primarily in Taiwan. It offers polished, annealed, epitaxial, and test wafers. The company was incorporated in 1995 and is headquartered in Yunlin, Taiwan. Formosa Sumco Technology Corporation is a subsidiary of Sumco Techxiv Corporation.

Key trends

Past 5 years