Taimide Tech. Inc.

Taiwan Stock Exchange 3645.TW

Taimide Tech. Inc. Current Liabilities for the year ending December 31, 2023: USD 40.70 M

Taimide Tech. Inc. Current Liabilities is USD 40.70 M for the year ending December 31, 2023, a 75.97% change year over year. Current liabilities are obligations that are expected to be settled within one year, including accounts payable, short-term debt, and other current liabilities.

Taimide Tech. Inc. Current Liabilities for the year ending December 31, 2022 was USD 23.13 M, a -39.33% change year over year.
Taimide Tech. Inc. Current Liabilities for the year ending December 31, 2021 was USD 38.12 M, a 17.75% change year over year.
Taimide Tech. Inc. Current Liabilities for the year ending December 31, 2020 was USD 32.37 M, a 7.18% change year over year.
Taimide Tech. Inc. Current Liabilities for the year ending December 31, 2019 was USD 30.20 M, a -11.81% change year over year.

Key data

Date	Current Liabilities	Total Non-Current Liabilities	Shareholders' Equity	Long-Term Debt

Taiwan Stock Exchange: 3645.TW

Taimide Tech. Inc.

CEO	Chen Ying Huang
IPO Date	Oct. 5, 2011
Location	Taiwan
Headquarters	No. 127, Wender Road
Employees	272
Sector	Technology
Industries Hardware & Electronics 3D Printing Ceramics Chemicals & Advanced Materials Composite Materials Containers & Packaging Plastics Semiconductors

Description

Taimide Tech. Inc. engages in the manufacture and sale of polyimide films (PI) in Taiwan and China. The company provides a range of polyimide films for use in flexible printed circuit boards (FPCB), coverlays, stiffeners, composited PIs, 3L FCCLs, general industry, heat-resistant tapes, pressure sensitive tapes, rigid-flex PCBs, flexible displays, flexible electronics, LED light bars, barcodes, etc. Taimide Tech. Inc. was incorporated in 2000 and is headquartered in Hsinchu City, Taiwan.

Key trends

Past 5 years