HPSP Co., Ltd.
KOSDAQ 403870.KQ
HPSP Co., Ltd. Market Capitalization on January 14, 2025: USD 1.56 B
HPSP Co., Ltd. Market Capitalization is USD 1.56 B on January 14, 2025, a -37.19% change year over year. Market capitalization represents total company value in stock market; higher suggests larger, more established company.
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HPSP Co., Ltd. 52-week high Market Capitalization is USD 3.78 B on February 15, 2024, which is 142.23% above the current Market Capitalization.
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HPSP Co., Ltd. 52-week low Market Capitalization is USD 1.37 B on December 20, 2024, which is -12.36% below the current Market Capitalization.
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HPSP Co., Ltd. average Market Capitalization for the last 52 weeks is USD 2.20 B.
Key data
| Date | Market Capitalization | Share Price | Price to Earnings Ratio (P/E) | Price to Sales Ratio (P/S) |
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Market news
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KOSDAQ: 403870.KQ
| CEO | Yong-Wun Kim |
| IPO Date | July 15, 2022 |
| Location | South Korea |
| Headquarters | 65, Omokcheon-ro 152 beon-gil |
| Employees | 94 |
| Sector | Technology |
| Industries | |
Description
HPSP Co., Ltd manufactures and markets high pressure annealing semiconductor equipment in South Korea and internationally. It offers GENI-SYS, a high-pressure thermal processing advance system; GENI, a high-pressure thermal processing system; and GENI-SE, a high-pressure oxidation system. The company also provides parts, parts repair and exchanges, installation support, and technical support services. HPSP Co., Ltd was founded in 2005 and is based in Suwon, South Korea.
Key trends
Past 5 years
StockViz Staff
January 15, 2025
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