MEC Company Ltd.

Tokyo Stock Exchange 4971.T

MEC Company Ltd. Debt to Equity Ratio for the year ending December 31, 2023: 0.00

MEC Company Ltd. Debt to Equity Ratio is 0.00 for the year ending December 31, 2023, a 0.00% change year over year. Debt to equity ratio represents the financing from debt versus equity. Higher ratio indicates more debt reliance, suggesting potential risk.

MEC Company Ltd. Debt to Equity Ratio for the year ending December 31, 2022 was 0.00, a 0.00% change year over year.
MEC Company Ltd. Debt to Equity Ratio for the year ending December 31, 2021 was 0.00, a -100.00% change year over year.
MEC Company Ltd. Debt to Equity Ratio for the year ending December 31, 2020 was 0.02, a -43.32% change year over year.
MEC Company Ltd. Debt to Equity Ratio for the year ending December 31, 2019 was 0.04, a -18.32% change year over year.

Key data

Date	Debt to Equity Ratio	Debt to Income Ratio	Debt to Tangible Net Worth Ratio	Dividend Coverage Ratio

Tokyo Stock Exchange: 4971.T

MEC Company Ltd.

CEO	Mr. Kazuo Maeda
IPO Date	April 7, 2003
Location	Japan
Headquarters	3-4-1, Kuise Minamishimmachi
Employees	454
Sector	Technology
Industries Hardware & Electronics 3D Printing Ceramics Chemicals & Advanced Materials Composite Materials Copper Petrochemicals Plastics

Description

MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards in Asia and Europe. It offers various chemicals for roughening type adhesion enhancement, rolled copper roughening treatment, and pre-lamination treatment of multilayer substrates; copper surface treatment for CO2 laser direct drilling; adhesion enhancement for high-frequency substrates; dry film and solder mask pretreatment; microetching; etch down; various residue removal treatment; degreasing, rust removal, and temporary anti-tarnish; metal resist stripping; HALS; copper seed layer etching; other metal surface treatment; and anisotropic etching. The company also provides AMALPHA, a metal surface treatment technology for direct metal and resin bonding. The company was incorporated in 1969 and is headquartered in Amagasaki, Japan.

Key trends

Past 5 years