MEC Company Ltd.

Tokyo Stock Exchange 4971.T

MEC Company Ltd. Dividend Yield on February 07, 2025: 1.58%

MEC Company Ltd. Dividend Yield is 1.58% on February 07, 2025, a 42.95% change year over year. Dividend yield measures the dividend per share relative to stock's price value; higher yield suggests higher dividend return.

MEC Company Ltd. 52-week high Dividend Yield is 1.63% on February 04, 2025, which is 2.97% above the current Dividend Yield.
MEC Company Ltd. 52-week low Dividend Yield is 1.06% on March 01, 2024, which is -32.76% below the current Dividend Yield.
MEC Company Ltd. average Dividend Yield for the last 52 weeks is 1.30%.

Key data

Date	Dividend Yield	Free Cash Flow Yield	Earnings Yield	Enterprise Value (EV)

Tokyo Stock Exchange: 4971.T

MEC Company Ltd.

CEO	Mr. Kazuo Maeda
IPO Date	April 7, 2003
Location	Japan
Headquarters	3-4-1, Kuise Minamishimmachi
Employees	454
Sector	Technology
Industries Hardware & Electronics 3D Printing Ceramics Chemicals & Advanced Materials Composite Materials Copper Petrochemicals Plastics

Description

MEC Company Ltd. engages in the research and development, production, and sale of chemicals, equipment, and related materials used in the production of printed circuit boards in Asia and Europe. It offers various chemicals for roughening type adhesion enhancement, rolled copper roughening treatment, and pre-lamination treatment of multilayer substrates; copper surface treatment for CO2 laser direct drilling; adhesion enhancement for high-frequency substrates; dry film and solder mask pretreatment; microetching; etch down; various residue removal treatment; degreasing, rust removal, and temporary anti-tarnish; metal resist stripping; HALS; copper seed layer etching; other metal surface treatment; and anisotropic etching. The company also provides AMALPHA, a metal surface treatment technology for direct metal and resin bonding. The company was incorporated in 1969 and is headquartered in Amagasaki, Japan.

Key trends

Past 5 years