Transcom, Inc.

Taiwan Stock Exchange 5222.TW

Transcom, Inc. Current Liabilities for the year ending December 31, 2023: USD 8.92 M

Transcom, Inc. Current Liabilities is USD 8.92 M for the year ending December 31, 2023, a 7.84% change year over year. Current liabilities are obligations that are expected to be settled within one year, including accounts payable, short-term debt, and other current liabilities.

Transcom, Inc. Current Liabilities for the year ending December 31, 2022 was USD 8.27 M, a 6.26% change year over year.
Transcom, Inc. Current Liabilities for the year ending December 31, 2021 was USD 7.79 M, a 21.68% change year over year.
Transcom, Inc. Current Liabilities for the year ending December 31, 2020 was USD 6.40 M, a -3.76% change year over year.
Transcom, Inc. Current Liabilities for the year ending December 31, 2019 was USD 6.65 M, a 86.80% change year over year.

Key data

Date	Current Liabilities	Total Non-Current Liabilities	Shareholders' Equity	Long-Term Debt

Taiwan Stock Exchange: 5222.TW

Transcom, Inc.

CEO	Mr. Quan Sheng Zhang
IPO Date	Dec. 19, 2012
Location	Taiwan
Headquarters	90 Dasoong 7th Road
Employees	291
Sector	Technology
Industries Hardware & Electronics Semiconductors Telecommunications & Networking

Description

Transcom, Inc. operates as a microwave device and subsystem company in Taiwan and internationally. The company offers wideband and narrowband solid-state power amplifiers; MIC and transceiver modules; FET chips; packaged FETs; monolithic microwave integrated circuits (MMIC); hybrid ICs; directional couplers; power dividers; fixed attenuators and termination products; and MIS chip capacitors. It also provides MMIC foundry services. Transcom, Inc. was founded in 1998 and is headquartered in Tainan City, Taiwan.

Key trends

Past 5 years