ASPEED Technology Inc.

Taipei Exchange 5274.TWO

ASPEED Technology Inc. Current Liabilities for the year ending December 31, 2023: USD 22.14 M

ASPEED Technology Inc. Current Liabilities is USD 22.14 M for the year ending December 31, 2023, a -51.00% change year over year. Current liabilities are obligations that are expected to be settled within one year, including accounts payable, short-term debt, and other current liabilities.

ASPEED Technology Inc. Current Liabilities for the year ending December 31, 2022 was USD 45.17 M, a 34.47% change year over year.
ASPEED Technology Inc. Current Liabilities for the year ending December 31, 2021 was USD 33.59 M, a 60.26% change year over year.
ASPEED Technology Inc. Current Liabilities for the year ending December 31, 2020 was USD 20.96 M, a -1.45% change year over year.
ASPEED Technology Inc. Current Liabilities for the year ending December 31, 2019 was USD 21.27 M, a 53.31% change year over year.

Key data

Date	Current Liabilities	Total Non-Current Liabilities	Shareholders' Equity	Long-Term Debt

Taipei Exchange: 5274.TWO

ASPEED Technology Inc.

CEO	Mr. Hongming Lin
IPO Date	June 20, 2012
Location	Taiwan
Headquarters	No. 1, Gongdao 5th Road
Employees	45
Sector	Technology
Industries Hardware & Electronics Semiconductors

Description

ASPEED Technology Inc. operates as a fabless integrated circuit (IC) design company in Taiwan, China, the United States, and internationally. It offers server management product lines; PC and AV extensions; and Cupola360, a spherical image processor for 360-degree cameras, as well as multimedia, computer peripherals, and high-end consumer electronics ICs. The company also provides research and development, technical, and software design services. ASPEED Technology Inc. was incorporated in 2004 and is headquartered in Hsinchu City, Taiwan.

Key trends

Past 5 years