Vanguard International Semiconductor Corporation

Taipei Exchange 5347.TWO

Vanguard International Semiconductor Corporation Free Cash Flow for the year ending December 31, 2023: USD 56.40 M

Vanguard International Semiconductor Corporation Free Cash Flow is USD 56.40 M for the year ending December 31, 2023, a -88.52% change year over year. Free cash flow is the amount of cash a company generates after accounting for cash outflows to support operations and maintain its capital assets.
  • Vanguard International Semiconductor Corporation Free Cash Flow for the year ending December 31, 2022 was USD 491.36 M, a 71.62% change year over year.
  • Vanguard International Semiconductor Corporation Free Cash Flow for the year ending December 31, 2021 was USD 286.31 M, a 16.33% change year over year.
  • Vanguard International Semiconductor Corporation Free Cash Flow for the year ending December 31, 2020 was USD 246.11 M, a 1,217.66% change year over year.
  • Vanguard International Semiconductor Corporation Free Cash Flow for the year ending December 31, 2019 was USD -22.02 M, a -112.20% change year over year.
Key data
Date Free Cash Flow Operating Cash Flow Net Cash Used For Investing Activities Net Cash Used Provided By Financing Activities
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Taipei Exchange: 5347.TWO

Vanguard International Semiconductor Corporation

CEO Mr. Chan-Jen Kuo
IPO Date Dec. 31, 2007
Location Taiwan
Headquarters Hsinchu Science Park
Employees 6,641
Sector Technology
Industries
Description

Vanguard International Semiconductor Corporation, together with its subsidiaries, engages in manufacturing, selling, packaging, testing, and computer-aided design of integrated circuits and other semiconductor devices in Taiwan and internationally. The company offers a range of foundry process technologies, including high voltage, ultra-high voltage, bipolar CMOS DMOS (BCD), silicon on insulator (SOI), discrete, mixed-signal, analog, and embedded flash technologies, as well as manufactures and sells masks. Its services include multiple project wafer services; mask services comprising frame generation, mask making, and mask repairing; backend services, including front-side metallization, backside grinding and metallization, chip probe, gallium nitride compound semiconductor material, WLCSP and RDL, and backend solutions; and automotive services, as well as provides intelligent manufacturing and management services. The company was incorporated in 1994 and is headquartered in Hsinchu, Taiwan.

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StockViz Staff

January 15, 2025

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