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China Wafer Level CSP Co., Ltd.

Shanghai Stock Exchange:603005.SS

Location

China

Market Cap

USD 2.54 B

Share Price

USD 3.90

Avg Daily Volume

21,880,956

Change (1 day)

1.27%

Change (1 year)

42.84%

Change (YTD)

0.84%

China Wafer Level CSP Co., Ltd. Share Price on June 27, 2025: USD 3.90

China Wafer Level CSP Co., Ltd. Share Price is USD 3.90 on June 27, 2025, a 42.84% change year over year. Share price reflects current trading price of a company's stock; influenced by market dynamics and company performance.
  • China Wafer Level CSP Co., Ltd. 52-week low Share Price is USD 5.16 on June 27, 2025, which is 32.23% above the current Share Price.
  • China Wafer Level CSP Co., Ltd. 52-week low Share Price is USD 2.41 on June 27, 2025, which is -38.34% below the current Share Price.
  • China Wafer Level CSP Co., Ltd. average Share Price for the last 52 weeks is USD 3.62.
Key data
Date Share Price Share Price Price to Earnings Ratio (P/E) Price to Book Ratio (P/B)
Market news
Shanghai Stock Exchange: 603005.SS

China Wafer Level CSP Co., Ltd.

CEO Mr. Wei Wang
IPO Date Feb. 10, 2014
Location China
Headquarters Suzhou Industrial Park
Employees 997
Sector 🤖 Technology
Industries
Hardware & Electronics
🖨 3D Printing
🤖 Artificial Intelligence (AI)
🌐 Internet of Things (IoT)
💻 Semiconductors
Description

China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers image sensor, biometric identification, and ambient light sensor chips, as well as medical electronic devices and automotive sensors. The company also provides infrastructure solutions, including design, test, and logistics; design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives; and FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. The company serves consumer, computing, communication, and medical markets. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.

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