ITEQ Corporation

Taiwan Stock Exchange 6213.TW

ITEQ Corporation Net Cash Used Provided By Financing Activities for the year ending December 31, 2023: USD -5.58 M

ITEQ Corporation Net Cash Used Provided By Financing Activities is USD -5.58 M for the year ending December 31, 2023, a 87.73% change year over year. Net cash used/provided by financing activities are the total cash inflows and outflows related to activities that finance the company’s operations, including debt, equity, and dividends.

ITEQ Corporation Net Cash Used Provided By Financing Activities for the year ending December 31, 2022 was USD -45.50 M, a -143.01% change year over year.
ITEQ Corporation Net Cash Used Provided By Financing Activities for the year ending December 31, 2021 was USD 105.80 M, a 551.47% change year over year.
ITEQ Corporation Net Cash Used Provided By Financing Activities for the year ending December 31, 2020 was USD 16.24 M, a 170.36% change year over year.
ITEQ Corporation Net Cash Used Provided By Financing Activities for the year ending December 31, 2019 was USD -23.08 M, a -248.30% change year over year.

Key data

Date	Net Cash Used Provided By Financing Activities	Dividends Paid	Capital Expenditure	Effect Of Forex Changes On Cash

Taiwan Stock Exchange: 6213.TW

ITEQ Corporation

CEO	Ms. Hsin-Hui Tsai
IPO Date	Jan. 21, 2008
Location	Taiwan
Headquarters	No.17, Daluge Road
Employees	3,385
Sector	Technology
Industries Hardware & Electronics 3D Printing Ceramics Composite Materials Computers Semiconductors

Description

ITEQ Corporation manufactures and sells copper clad laminate materials used for fabrication of printed circuit boards in Taiwan and Asia. It offers mass lamination boards, copper clad laminates, prepreg products, and electronic components. The company's products are used in various application areas, such as computational and communications applications comprising servers, storage, and switches; radio frequency and microwave devices, consisting of 5G and mmWaves; automotive applications, including advanced driver assist systems; and high density interconnect solutions, which include smartphones. It also exports its products. The company was founded in 1997 and is headquartered in Hsinchu City, Taiwan.

Key trends

Past 5 years