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Powertech Technology Inc.

Taiwan Stock Exchange:6239.TW

Location

Taiwan

Market Cap

USD 3.35 B

Share Price

USD 4.53

Avg Daily Volume

5,894,453

Change (1 day)

0.49%

Change (1 year)

-22.42%

Change (YTD)

21.96%

Powertech Technology Inc. Enterprise Value to EBITDA (EV/EBITDA) on June 27, 2025: 5.20

Powertech Technology Inc. Enterprise Value to EBITDA (EV/EBITDA) is 5.20 on June 27, 2025, a -11.24% change year over year. EV/EBITDA ratio compares the enterprise value to the EBITDA; lower suggests more favorable company valuation.
  • Powertech Technology Inc. 52-week low Enterprise Value to EBITDA (EV/EBITDA) is 6.14 on June 27, 2025, which is 18.12% above the current Enterprise Value to EBITDA (EV/EBITDA).
  • Powertech Technology Inc. 52-week low Enterprise Value to EBITDA (EV/EBITDA) is 3.65 on June 27, 2025, which is -29.75% below the current Enterprise Value to EBITDA (EV/EBITDA).
  • Powertech Technology Inc. average Enterprise Value to EBITDA (EV/EBITDA) for the last 52 weeks is 4.48.
Key data
Date Enterprise Value to EBITDA (EV/EBITDA) Free Cash Flow Yield Dividend Yield Market Capitalization
Market news
Taiwan Stock Exchange: 6239.TW

Powertech Technology Inc.

CEO Mr. Pangzhang Zeng
IPO Date Nov. 8, 2004
Location Taiwan
Headquarters Hsinchu Industrial Park
Employees 8,895
Sector 🤖 Technology
Industries
Hardware & Electronics
🖨 3D Printing
💻 Computers
💻 Semiconductors
Description

Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products primarily in Taiwan. It offers packaging and testing services, such as high pin-count thin small outline package, multi-chip packaging (MCP, S-MCP), ball grid array (wBGA, FBGA) IC, solid state drive (SSD), embedded memory (eMMC, eMCP, UFS), DRAM chip-stacking, mobile memory, Package on Package/Package in Package, CMOS image sensor, and fan-out panel level, as well as secured digital memory card (SD, microSD) and USB. The company also provides Quad Flat No-leads, wafer bumping, system-in-package, wafer level chip scale package, flip-chip, copper pillar bump flip chip, electro-magnetic interference shield package, and module and system packaging services; and wafer testing and redistribution layer services. In addition, it is involved in the design, manufacturing, assembly, testing, and sale of semiconductors, as well as investment and wafer probing testing activities. The company also operates in Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and internationally. Powertech Technology Inc. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

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