Tong Hsing Electronic Industries, Ltd.

Taiwan Stock Exchange 6271.TW

Tong Hsing Electronic Industries, Ltd. EBITDA Margin for the year ending December 31, 2023: 24.47%

Tong Hsing Electronic Industries, Ltd. EBITDA Margin is 24.47% for the year ending December 31, 2023, a -34.19% change year over year. EBITDA Ratio is the proportion of Earnings Before Interest, Taxes, Depreciation, and Amortization to total revenue, assessing a company's operational profitability before non-operating expenses and non-cash charges.

Tong Hsing Electronic Industries, Ltd. EBITDA Margin for the year ending December 31, 2022 was 37.19%, a 3.59% change year over year.
Tong Hsing Electronic Industries, Ltd. EBITDA Margin for the year ending December 31, 2021 was 35.90%, a 26.44% change year over year.
Tong Hsing Electronic Industries, Ltd. EBITDA Margin for the year ending December 31, 2020 was 28.39%, a 24.13% change year over year.
Tong Hsing Electronic Industries, Ltd. EBITDA Margin for the year ending December 31, 2019 was 22.87%, a -20.53% change year over year.

Key data

Date	EBITDA Margin	EBIT Margin	Depreciation and Amortization	EBIT

Taiwan Stock Exchange: 6271.TW

Tong Hsing Electronic Industries, Ltd.

CEO	Mr. Shao-Pin Ru
IPO Date	Nov. 16, 2007
Location	Taiwan
Headquarters	83, Yenping South Road
Employees	3,698
Sector	Technology
Industries Hardware & Electronics 3D Printing Automotive Parts Ceramics Semiconductors

Description

Tong Hsing Electronic Industries, Ltd. develops, manufactures, and sells micro modules and custom semiconductor packages in Taiwan. The company provides semiconductor micro module assembly, and thick and thin film substrate foundry services. It also offers microelectronic packaging technologies, such as assembly packaging services, backend technology and others, and RF testing services. In addition, the company provides contract manufacturing services for microelectronic packaging and ceramic thick/thin film substrate fabrication. Its products are used in IGBT, high-frequency switching power supply, automotive, aerospace, solar cell component, telecommunication power supply, laser system, high power LED, microwave, semiconductor process equipment, hybrid electric vehicles, computer peripherals, medical and network equipment, and sensor applications. The company was founded in 1974 and is headquartered in Taipei, Taiwan.

Key trends

Past 5 years