GlobalWafers Co., Ltd.

Taipei Exchange 6488.TWO

GlobalWafers Co., Ltd. Current Liabilities for the year ending December 31, 2023: USD 2.42 B

GlobalWafers Co., Ltd. Current Liabilities is USD 2.42 B for the year ending December 31, 2023, a 107.21% change year over year. Current liabilities are obligations that are expected to be settled within one year, including accounts payable, short-term debt, and other current liabilities.

GlobalWafers Co., Ltd. Current Liabilities for the year ending December 31, 2022 was USD 1.17 B, a 4.22% change year over year.
GlobalWafers Co., Ltd. Current Liabilities for the year ending December 31, 2021 was USD 1.12 B, a 7.44% change year over year.
GlobalWafers Co., Ltd. Current Liabilities for the year ending December 31, 2020 was USD 1.04 B, a 15.91% change year over year.
GlobalWafers Co., Ltd. Current Liabilities for the year ending December 31, 2019 was USD 899.62 M, a 12.65% change year over year.

Key data

Date	Current Liabilities	Total Non-Current Liabilities	Shareholders' Equity	Long-Term Debt

Taipei Exchange: 6488.TWO

GlobalWafers Co., Ltd.

CEO	Ms. Hsiu-Lan Hsu
IPO Date	Oct. 30, 2014
Location	Taiwan
Headquarters	Hsinchu Science Park
Employees	657
Sector	Technology
Industries Semiconductors Chemicals & Advanced Materials

Description

GlobalWafers Co., Ltd., together with its subsidiaries, researches, designs, develops, and manufactures semiconductor ingots and wafers in Taiwan and internationally. It offers silicon wafer and ingots; and annealed, diffusion, epitaxial, compound, polished, and SOI wafers. The company was incorporated in 2011 and is based in Hsinchu City, Taiwan. GlobalWafers Co., Ltd. is a subsidiary of Sino-American Silicon Products Inc.

Key trends

Past 5 years