GlobalWafers Co., Ltd.
Taipei Exchange 6488.TWO
GlobalWafers Co., Ltd. Dividends Paid for the year ending December 31, 2023: USD -226.84 M
GlobalWafers Co., Ltd. Dividends Paid is USD -226.84 M for the year ending December 31, 2023, a 0.14% change year over year. Dividends paid is cash paid to shareholders as a distribution of profits.
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GlobalWafers Co., Ltd. Dividends Paid for the year ending December 31, 2022 was USD -227.17 M, a 19.62% change year over year.
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GlobalWafers Co., Ltd. Dividends Paid for the year ending December 31, 2021 was USD -282.61 M, a 26.94% change year over year.
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GlobalWafers Co., Ltd. Dividends Paid for the year ending December 31, 2020 was USD -386.84 M, a -6.35% change year over year.
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GlobalWafers Co., Ltd. Dividends Paid for the year ending December 31, 2019 was USD -363.75 M, a -154.40% change year over year.
Key data
| Date | Dividends Paid | Capital Expenditure | Other Financing Activities | Net Cash Used Provided By Financing Activities |
|---|
Market news
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Taipei Exchange: 6488.TWO
| CEO | Ms. Hsiu-Lan Hsu |
| IPO Date | Oct. 30, 2014 |
| Location | Taiwan |
| Headquarters | Hsinchu Science Park |
| Employees | 657 |
| Sector | Technology |
| Industries | |
Description
GlobalWafers Co., Ltd., together with its subsidiaries, researches, designs, develops, and manufactures semiconductor ingots and wafers in Taiwan and internationally. It offers silicon wafer and ingots; and annealed, diffusion, epitaxial, compound, polished, and SOI wafers. The company was incorporated in 2011 and is based in Hsinchu City, Taiwan. GlobalWafers Co., Ltd. is a subsidiary of Sino-American Silicon Products Inc.
Key trends
Past 5 years
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StockViz Staff
January 15, 2025
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