ULVAC, Inc.

Tokyo Stock Exchange 6728.T

ULVAC, Inc. Debt to Equity Ratio for the year ending June 30, 2024: 0.23

ULVAC, Inc. Debt to Equity Ratio is 0.23 for the year ending June 30, 2024, a -0.68% change year over year. Debt to equity ratio represents the financing from debt versus equity. Higher ratio indicates more debt reliance, suggesting potential risk.
  • ULVAC, Inc. Debt to Equity Ratio for the year ending June 30, 2023 was 0.23, a 2.30% change year over year.
  • ULVAC, Inc. Debt to Equity Ratio for the year ending June 30, 2022 was 0.23, a -11.19% change year over year.
  • ULVAC, Inc. Debt to Equity Ratio for the year ending June 30, 2021 was 0.25, a -25.13% change year over year.
  • ULVAC, Inc. Debt to Equity Ratio for the year ending June 30, 2020 was 0.34, a 40.97% change year over year.
Key data
Date Debt to Equity Ratio Debt to Income Ratio Debt to Tangible Net Worth Ratio Dividend Coverage Ratio
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SV Wall Street
Tokyo Stock Exchange: 6728.T

ULVAC, Inc.

Description

ULVAC, Inc. engages in the development, manufacture, sale, customer support, and import/export of vacuum equipment, peripheral devices, and vacuum components and materials in Japan and internationally. The company offers various equipment, including sputtering, chemical vapor deposition, vacuum evaporation, vapor deposition polymerization, ashing, etching, ion implantation, vacuum furnaces, roll coaters, freeze drying/vacuum drying, vacuum distillation systems, and other products. It also provides components that comprise vacuum pumps, vacuum gauges, process gas monitors, leak detectors, spectroscopic ellipsometers, deposition controllers, vacuum valves, power supplies, vacuum transfer robots, molecular interaction analyzers, microplate paddle mixers, film forming equipment, refrigerators, and heat treatment and thermal properties. In addition, the company offers sputtering targets, high performance materials, and nano-metal inks, as well as deposition and etching technologies used in packaging processes; technical solutions for the production of power devices; delivering systems for SiC and Si; and solutions for micro-powder dry systems and touch screens. It serves display, solar cell, semiconductor, electronics, electrics, metals, machinery, automotive, chemical, food, and pharmaceutical industries, as well as universities and research centers. The company was incorporated in 1929 and is headquartered in Chigasaki, Japan.

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StockViz Staff

February 2, 2025

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