Powerchip Semiconductor Manufacturing Corp.

Taiwan Stock Exchange 6770.TW

Powerchip Semiconductor Manufacturing Corp. Dividends Paid for the year ending December 31, 2023: USD -39.63 M

Powerchip Semiconductor Manufacturing Corp. Dividends Paid is USD -39.63 M for the year ending December 31, 2023, a 82.95% change year over year. Dividends paid is cash paid to shareholders as a distribution of profits.

Powerchip Semiconductor Manufacturing Corp. Dividends Paid for the year ending December 31, 2022 was USD -232.42 M, a -72.30% change year over year.
Powerchip Semiconductor Manufacturing Corp. Dividends Paid for the year ending December 31, 2021 was USD -134.89 M, a -532.36% change year over year.
Powerchip Semiconductor Manufacturing Corp. Dividends Paid for the year ending December 31, 2020 was USD -21.33 M, a -570.02% change year over year.
Powerchip Semiconductor Manufacturing Corp. Dividends Paid for the year ending December 31, 2019 was USD -3.18 M, a 97.51% change year over year.

Key data

Date	Dividends Paid	Capital Expenditure	Other Financing Activities	Net Cash Used Provided By Financing Activities

Taiwan Stock Exchange: 6770.TW

Powerchip Semiconductor Manufacturing Corp.

CEO	Mr. Chongren Huang
IPO Date	Dec. 9, 2020
Location	Taiwan
Headquarters	Hsinchu Science Park
Employees	7,108
Sector	Technology
Industries Semiconductors Engineering Services Hardware & Electronics

Description

Powerchip Semiconductor Manufacturing Corporation provides chip design and manufacturing services. It offers foundry, design, overhaul, manufacturing, and memory wafer testing services. The company was formerly known as Maxchip Electronics Corp and changed its name to Powerchip Semiconductor Manufacturing Corporation in September 2018. Powerchip Semiconductor Manufacturing Corporation was founded in 2008 and is headquartered in Hsinchu, Taiwan. Powerchip Semiconductor Manufacturing Corp. operates as a subsidiary of Powerchip Technology Corporation.

Key trends

Past 5 years