Dosilicon Co., Ltd.

Shanghai Stock Exchange 688110.SS

Dosilicon Co., Ltd. Dividend Per Share for the year ending December 31, 2023: USD 0.02

Dosilicon Co., Ltd. Dividend Per Share is USD 0.02 for the year ending December 31, 2023, a -32.21% change year over year. Dividend per share represents the dividends distributed per share. Indicates dividend yield potential on a per-share basis.

Dosilicon Co., Ltd. Dividend Per Share for the year ending December 31, 2022 was USD 0.03, a 4,940.11% change year over year.
Dosilicon Co., Ltd. Dividend Per Share for the year ending December 31, 2021 was USD 0.00, a -67.39% change year over year.
Dosilicon Co., Ltd. Dividend Per Share for the year ending December 31, 2020 was USD 0.00, a -64.92% change year over year.
Dosilicon Co., Ltd. Dividend Per Share for the year ending December 31, 2019 was USD 0.00, a 203.14% change year over year.

Key data

Date	Dividend Per Share	Free Cash Flow Per Share	Return on Assets (ROA)	Return on Equity (ROE)

Shanghai Stock Exchange: 688110.SS

Dosilicon Co., Ltd.

CEO	Ms. Yingxia Xie
IPO Date	Dec. 10, 2021
Location	China
Headquarters	L4A-F5, Hongqiao World Center
Employees	262
Sector	Technology
Industries Hardware & Electronics 3D Printing Artificial Intelligence (AI) Computers Semiconductors Smartphones

Description

Dosilicon Co., Ltd., a fabless memory solution company, engages in the design, production, and sale of memory chips worldwide. The company offers NAND flash, NOR flash, and dynamic random-access memory chips, as well as multiple chip packages. Its products have applications in the industrial control, mobile devices, communication network, internet of things, and security sectors. The company was founded in 2014 and is headquartered in Shanghai, China.

Key trends

Past 5 years