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Circuit Fabology Microelectronics Equipment Co.,Ltd.

Shanghai Stock Exchange:688630.SS

Location

China

Market Cap

USD 1.43 B

Share Price

USD 10.88

Avg Daily Volume

4,544,482

Change (1 day)

0.63%

Change (1 year)

12.85%

Change (YTD)

37.56%

Circuit Fabology Microelectronics Equipment Co.,Ltd. Interest Coverage Ratio for the year ending December 31, 2024: 173.49

Circuit Fabology Microelectronics Equipment Co.,Ltd. Interest Coverage Ratio is 173.49 for the year ending December 31, 2024, a -17.45% change year over year. Interest coverage ratio assesses earnings' ability to cover interest expenses; higher ratios signal lower risk.
  • Circuit Fabology Microelectronics Equipment Co.,Ltd. Interest Coverage Ratio for the year ending December 31, 2023 was 210.16, a -69.43% change year over year.
  • Circuit Fabology Microelectronics Equipment Co.,Ltd. Interest Coverage Ratio for the year ending December 31, 2022 was 687.43, a 1,115.82% change year over year.
  • Circuit Fabology Microelectronics Equipment Co.,Ltd. Interest Coverage Ratio for the year ending December 31, 2021 was 56.54, a -89.42% change year over year.
  • Circuit Fabology Microelectronics Equipment Co.,Ltd. Interest Coverage Ratio for the year ending December 31, 2020 was 534.42, a -93.63% change year over year.
Key data
Date Interest Coverage Ratio Return on Capital Employed (ROCE) Return on Equity (ROE) Return on Assets (ROA)
Market news
Shanghai Stock Exchange: 688630.SS

Circuit Fabology Microelectronics Equipment Co.,Ltd.

CEO Mr. Lin Fang
IPO Date April 1, 2021
Location China
Headquarters No.2800, Chuangxin Avenue
Employees 539
Sector 🤖 Technology
Industries
3D Printing
💻 Computers
🔌 Hardware & Electronics
🔩 Machinery
💻 Semiconductors
Description

Circuit Fabology Microelectronics Equipment Co.,Ltd. engages in the research, development, and manufacture of direct imaging equipment and direct writing lithography equipment. Its product portfolio includes PCB direct imaging equipment and automatic line systems, pan-semiconductor direct writing lithography equipment and automatic line systems, and other laser direct imaging equipment. The company's direct writing lithography equipment is used in IC mask plate making, IC manufacturing, MEMS chip, flat panel displays, advanced packaging, and biochip direct writing lithography, as well as research and production of various micro-nano lithography processing fields; and direct imaging equipment is used in IC carrier boards and class carrier boards, flexible boards, rigid-flex boards, HDI boards, multi-layer boards, and solder mask process, as well as in automation and smart PCB factories. It serves the electronic information industry. The company was founded in 2015 and is based in Hefei, China.

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