Kyoei Sangyo Co.,Ltd.

Tokyo Stock Exchange 6973.T

Kyoei Sangyo Co.,Ltd. Dividend Per Share for the year ending March 31, 2024: USD 0.47

Kyoei Sangyo Co.,Ltd. Dividend Per Share is USD 0.47 for the year ending March 31, 2024, a -11.54% change year over year. Dividend per share represents the dividends distributed per share. Indicates dividend yield potential on a per-share basis.
  • Kyoei Sangyo Co.,Ltd. Dividend Per Share for the year ending March 31, 2023 was USD 0.53, a 60.06% change year over year.
  • Kyoei Sangyo Co.,Ltd. Dividend Per Share for the year ending March 31, 2022 was USD 0.33, a 21.48% change year over year.
  • Kyoei Sangyo Co.,Ltd. Dividend Per Share for the year ending March 31, 2021 was USD 0.27, a -27.16% change year over year.
  • Kyoei Sangyo Co.,Ltd. Dividend Per Share for the year ending March 31, 2020 was USD 0.37, a -17.52% change year over year.
Key data
Date Dividend Per Share Free Cash Flow Per Share Return on Assets (ROA) Return on Equity (ROE)
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Tokyo Stock Exchange: 6973.T

Kyoei Sangyo Co.,Ltd.

CEO Jun Hirasawa
IPO Date Jan. 4, 2001
Location Japan
Headquarters 20-4, 2chome, Shoto
Employees 890
Sector Technology
Industries
Description

Kyoei Sangyo Co.,Ltd. sells semiconductors, electric devices, industrial machinery, printed circuit boards, software, and information and communication systems. It supplies semiconductor products, such as microcomputer, memory, ASIC, exclusive and general-purpose IC, and discreet products, as well as power, optical, high frequency, and security device products; and electronic devices comprising fuses, polyswitches, varistors, serge absorbers, thermistors, EMI filters, liquid crystal panels, common/normal mode coils, LED products, and soft ferrites. The company also offers electronic materials, including phosphor bronze, nickel silver, beryllium copper, yellow brass, special alloy, rare earth magnet, PCB materials, semiconductor lead frames, interface cables, synthetic products, and resin products; processing machines, such as laser beam and electrical discharge machines; and CNC units, senser solutions, industrial-use robots, FA-IT solutions, and metal and plastic 3D printers. In addition, it provides FA and cold heating equipment, industrial robots, manufacturing products, inverters, moist processors, air conditioner updates, LED lightnings, and eco pumps, as well as energy saving, solar, video/security, hygiene, and other products; and manufactures build-up construction, metal cored, multi-layer, and flexible printed wiring boards, as well as printed wiring board for modules. Further, the company develops software for construction industry comprising integration, quotation related, execution budget, cost management, ERP, repair plan making, and other systems, as well as embedded systems and hardware products; provides software for various industries; and manufactures printed circuit boards. Additionally, it develops information and communication systems; offers robot AI solutions; and designs IC. The company was founded in 1947 and is headquartered in Tokyo, Japan.

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StockViz Staff

January 15, 2025

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