Hokuriku Electric Industry Co.,Ltd.

Tokyo Stock Exchange 6989.T

Hokuriku Electric Industry Co.,Ltd. Debt to Equity Ratio for the year ending March 31, 2024: 0.48

Hokuriku Electric Industry Co.,Ltd. Debt to Equity Ratio is 0.48 for the year ending March 31, 2024, a -26.74% change year over year. Debt to equity ratio represents the financing from debt versus equity. Higher ratio indicates more debt reliance, suggesting potential risk.

Hokuriku Electric Industry Co.,Ltd. Debt to Equity Ratio for the year ending March 31, 2023 was 0.66, a 5.76% change year over year.
Hokuriku Electric Industry Co.,Ltd. Debt to Equity Ratio for the year ending March 31, 2022 was 0.63, a -13.37% change year over year.
Hokuriku Electric Industry Co.,Ltd. Debt to Equity Ratio for the year ending March 31, 2021 was 0.72, a -6.90% change year over year.
Hokuriku Electric Industry Co.,Ltd. Debt to Equity Ratio for the year ending March 31, 2020 was 0.78, a -24.39% change year over year.

Key data

Date	Debt to Equity Ratio	Debt to Income Ratio	Debt to Tangible Net Worth Ratio	Dividend Coverage Ratio

Tokyo Stock Exchange: 6989.T

Hokuriku Electric Industry Co.,Ltd.

CEO	Mr. Ryusho Shimosaka
IPO Date	Jan. 1, 2001
Location	Japan
Headquarters	3158 Shimo-okubo
Employees	1,877
Sector	Technology
Industries Hardware & Electronics

Description

Hokuriku Electric Industry Co.,Ltd. develops, manufactures, and sells electronic components in Japan and internationally. It offers pressure sensors, force sensors, pressure sensor modules, barometric pressure sensors, humidity sensors elements and modules; circuit modules, DC/DC converters, and low power RF transceiver modules and modems; high frequency components; piezoelectric speakers and actuators; chip fixed resistors and network chip fixed resistors; and metal plate chip fixed resistors. The company also provides fixed metal film, fixed metal oxide film, and fixed carbon film resistors; chip type and miniature cermet trimmer potentiometers; glass sealed radial lead, glass sealed axial lead, epoxy resin coated radial lead thermistors; tactile switches; and printed circuit boards. Its products are used in mobile communication, digital/PC, car electronic, and home electronic applications. The company was incorporated in 1943 and is based in Toyama, Japan.

Key trends

Past 5 years