Advanced Wireless Semiconductor Company

Taipei Exchange 8086.TWO

Advanced Wireless Semiconductor Company Debt to Equity Ratio for the year ending December 31, 2023: 0.07

Advanced Wireless Semiconductor Company Debt to Equity Ratio is 0.07 for the year ending December 31, 2023, a 460.10% change year over year. Debt to equity ratio represents the financing from debt versus equity. Higher ratio indicates more debt reliance, suggesting potential risk.

Advanced Wireless Semiconductor Company Debt to Equity Ratio for the year ending December 31, 2022 was 0.01, a 8.05% change year over year.
Advanced Wireless Semiconductor Company Debt to Equity Ratio for the year ending December 31, 2021 was 0.01, a -9.09% change year over year.
Advanced Wireless Semiconductor Company Debt to Equity Ratio for the year ending December 31, 2020 was 0.01, a -89.88% change year over year.
Advanced Wireless Semiconductor Company Debt to Equity Ratio for the year ending December 31, 2019 was 0.12, a 1,075.13% change year over year.

Key data

Date	Debt to Equity Ratio	Debt to Income Ratio	Debt to Tangible Net Worth Ratio	Dividend Coverage Ratio

Taipei Exchange: 8086.TWO

Advanced Wireless Semiconductor Company

CEO	Yan Shu Liu
IPO Date	Dec. 31, 2007
Location	Taiwan
Headquarters	No.6, Da-Li 1st Road
Employees	778
Sector	Technology
Industries Semiconductors Engineering Services Hardware & Electronics Telecommunications & Networking

Description

Advanced Wireless Semiconductor Company provides foundry services in Taiwan. The company offers InGaP/GaAs HBT process for power amplifier and gain block circuit designs; GaAs E/D pHEMT process for switch and low noise amplifier designs; and ED BiHEMT technology for level integration single-chip designs in smart phone and WiFi applications. It also provides HBT, ED pHEMT, ED BiHEMT, IPD, bump for RF/wireless, and VCSEL/optical services. Advanced Wireless Semiconductor Company was founded in 1998 and is based in Tainan City, Taiwan.

Key trends

Past 5 years