Formosa Advanced Technologies Co., Ltd.

Taiwan Stock Exchange 8131.TW

Formosa Advanced Technologies Co., Ltd. EBITDA Margin for the year ending December 31, 2023: 24.10%

Formosa Advanced Technologies Co., Ltd. EBITDA Margin is 24.10% for the year ending December 31, 2023, a -34.63% change year over year. EBITDA Ratio is the proportion of Earnings Before Interest, Taxes, Depreciation, and Amortization to total revenue, assessing a company's operational profitability before non-operating expenses and non-cash charges.

Formosa Advanced Technologies Co., Ltd. EBITDA Margin for the year ending December 31, 2022 was 36.86%, a 9.20% change year over year.
Formosa Advanced Technologies Co., Ltd. EBITDA Margin for the year ending December 31, 2021 was 33.76%, a -1.94% change year over year.
Formosa Advanced Technologies Co., Ltd. EBITDA Margin for the year ending December 31, 2020 was 34.43%, a -2.05% change year over year.
Formosa Advanced Technologies Co., Ltd. EBITDA Margin for the year ending December 31, 2019 was 35.15%, a 8.54% change year over year.

Key data

Date	EBITDA Margin	EBIT Margin	Depreciation and Amortization	EBIT

Taiwan Stock Exchange: 8131.TW

Formosa Advanced Technologies Co., Ltd.

CEO	Mr. Hsien-Cheng Chang
IPO Date	Nov. 29, 2007
Location	Taiwan
Headquarters	329, Ho-Nan Street
Employees	2,313
Sector	Technology
Industries Hardware & Electronics 3D Printing Automotive Parts Semiconductors

Description

Formosa Advanced Technologies Co., Ltd. provides wafer probe, integrated circuit (IC) assembly and testing, module turnkey, and LED chip services in Taiwan. It provides IC package solutions for portable electronic products, cell phones, memory modules, PC cards, PDAs, disc drives, and telephone handsets; DIMM products for laptops; flash cards; and LED products comprising PLCC, EMC, and UV LED products. The company also offers assembly services; and testing services, including wafer probe, burn in, and final testing services for memory, and logical and mixed-signal semiconductors, as well as testing program verification, tester/hi-fix correlation, engineering lot support, production lot verification, and periodical report. In addition, it provides module services, such as customized products, and OEM and ODM services, as well as blank DRAM modules, including U-DIMM, SO-DIMM, R-DIMM, and FB-DIMM; and LED chip back-end services, such as grinding, dicing, probing, sorting, and PI services. The company was founded in 1990 and is headquartered in Douliou City, Taiwan.

Key trends

Past 5 years