Aehr Test Systems

NasdaqCM AEHR

Aehr Test Systems Debt to Equity Ratio for the Trailing 12 Months (TTM) ending November 29, 2024: 0.06

Aehr Test Systems Debt to Equity Ratio is 0.06 for the Trailing 12 Months (TTM) ending November 29, 2024, a -29.07% change year over year. Debt to equity ratio represents the financing from debt versus equity. Higher ratio indicates more debt reliance, suggesting potential risk.
  • Aehr Test Systems Debt to Equity Ratio for the Trailing 12 Months (TTM) ending November 30, 2023 was 0.08, a 356.03% change year over year.
  • Aehr Test Systems Debt to Equity Ratio for the Trailing 12 Months (TTM) ending November 30, 2022 was 0.02, a -89.21% change year over year.
  • Aehr Test Systems Debt to Equity Ratio for the Trailing 12 Months (TTM) ending November 30, 2021 was 0.17, a -35.90% change year over year.
  • Aehr Test Systems Debt to Equity Ratio for the Trailing 12 Months (TTM) ending November 30, 2020 was 0.26, a 48.68% change year over year.
Key data
Date Debt to Equity Ratio Debt to Income Ratio Debt to Tangible Net Worth Ratio Dividend Coverage Ratio
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SV Wall Street
NasdaqCM: AEHR

Aehr Test Systems

CEO Mr. Gayn Erickson
IPO Date Aug. 15, 1997
Location United States
Headquarters 400 Kato Terrace
Employees 115
Sector Technology
Industries
Description

Aehr Test Systems provides test systems for burning-in and testing logic, optical, and memory integrated circuits worldwide. It offers products, such as the ABTS and FOX-P families of test and burn-in systems and FOX WaferPak Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for lower power and higher power logic devices, as well as various common types of memory devices. The FOX-XP and FOX-NP systems are wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The FOX-CP system is a single-wafer compact test and reliability verification solution for logic, memory, and photonic devices. The WaferPak Contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform final test and burn-in of bare die and modules. Aehr Test Systems was incorporated in 1977 and is headquartered in Fremont, California.

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StockViz Staff

February 4, 2025

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