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BE Semiconductor Industries N.V.

Amsterdam Stock Exchange:BESI.AS

Location

Netherlands

Market Cap

USD 11.81 B

Share Price

USD 149.64

Avg Daily Volume

536,403

Change (1 day)

2.84%

Change (1 year)

-6.89%

Change (YTD)

9.23%

BE Semiconductor Industries N.V. Net Cash Used Provided By Financing Activities for the year ending December 31, 2024: USD 91.82 M

BE Semiconductor Industries N.V. Net Cash Used Provided By Financing Activities is USD 91.82 M for the year ending December 31, 2024, a -118.91% change year over year. Net cash used/provided by financing activities are the total cash inflows and outflows related to activities that finance the company’s operations, including debt, equity, and dividends.
  • BE Semiconductor Industries N.V. Net Cash Used Provided By Financing Activities for the year ending December 31, 2023 was USD -485.43 M, a 83.18% change year over year.
  • BE Semiconductor Industries N.V. Net Cash Used Provided By Financing Activities for the year ending December 31, 2022 was USD -265.00 M, a 27.86% change year over year.
  • BE Semiconductor Industries N.V. Net Cash Used Provided By Financing Activities for the year ending December 31, 2021 was USD -207.26 M, a -427.24% change year over year.
  • BE Semiconductor Industries N.V. Net Cash Used Provided By Financing Activities for the year ending December 31, 2020 was USD 63.34 M, a -132.55% change year over year.
Key data
Date Net Cash Used Provided By Financing Activities Depreciation And Amortization Dividends Paid Common Stock Issued
Market news
Amsterdam Stock Exchange: BESI.AS

BE Semiconductor Industries N.V.

CEO Mr. Richard W. Blickman
IPO Date July 20, 1998
Location Netherlands
Headquarters Ratio 6
Employees 1,820
Sector 🤖 Technology
Industries
Hardware & Electronics
🖨 3D Printing
💻 Computers
💻 Semiconductors
🏗️ Steel
Description

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

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