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BE Semiconductor Industries N.V.

Amsterdam Stock Exchange:BESI.AS

Location

Netherlands

Market Cap

USD 11.41 B

Share Price

USD 143.32

Avg Daily Volume

536,403

Change (1 day)

-0.71%

Change (1 year)

-14.27%

Change (YTD)

4.62%

BE Semiconductor Industries N.V. Share Price Year-To-Date (YTD) return on June 19, 2025: 4.62%

BE Semiconductor Industries N.V. Share Price Year-To-Date (YTD) return is 4.62% on June 19, 2025. Share price reflects current trading price of a company's stock; influenced by market dynamics and company performance. Year-to-Date (YTD) return is is the percentage change in the price of a stock from the start of the calendar year up to the current date, it shows how much the stock has gained or lost since the beginning of the year.
  • BE Semiconductor Industries N.V. 52-week low Share Price is USD 185.19 on June 19, 2025, which is 29.21% above the current Share Price.
  • BE Semiconductor Industries N.V. 52-week low Share Price is USD 87.14 on June 19, 2025, which is -39.20% below the current Share Price.
  • BE Semiconductor Industries N.V. average Share Price for the last 52 weeks is USD 127.44.
Key data
Date Share Price Year-To-Date (YTD) return Price to Earnings Ratio (P/E) Price to Book Ratio (P/B) Price to Sales Ratio (P/S)
Market news
Amsterdam Stock Exchange: BESI.AS

BE Semiconductor Industries N.V.

CEO Mr. Richard W. Blickman
IPO Date July 20, 1998
Location Netherlands
Headquarters Ratio 6
Employees 1,820
Sector 🤖 Technology
Industries
Hardware & Electronics
🖨 3D Printing
💻 Computers
💻 Semiconductors
🏗️ Steel
Description

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

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