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Lam Research Corporation

NasdaqGS:LRCX

Location

United States

Market Cap

USD 117.18 B

Share Price

USD 91.61

Avg Daily Volume

12,093,644

Change (1 day)

1.24%

Change (1 year)

-12.79%

Change (YTD)

26.83%

Lam Research Corporation Research and Development (R&D) Expenses for the Trailing 12 Months (TTM) ending March 30, 2025: USD 2.01 B

Lam Research Corporation Research and Development (R&D) Expenses is USD 2.01 B for the Trailing 12 Months (TTM) ending March 30, 2025, a 11.48% change year over year. Research and development (R&D) expenses are the costs associated with the development of new products, technologies, or improvements to existing products.
  • Lam Research Corporation Research and Development (R&D) Expenses for the Trailing 12 Months (TTM) ending March 31, 2024 was USD 1.81 B, a 4.04% change year over year.
  • Lam Research Corporation Research and Development (R&D) Expenses for the Trailing 12 Months (TTM) ending March 26, 2023 was USD 1.74 B, a 10.26% change year over year.
  • Lam Research Corporation Research and Development (R&D) Expenses for the Trailing 12 Months (TTM) ending March 27, 2022 was USD 1.57 B, a 8.57% change year over year.
  • Lam Research Corporation Research and Development (R&D) Expenses for the Trailing 12 Months (TTM) ending March 28, 2021 was USD 1.45 B, a 19.95% change year over year.
Key data
Date Research and Development (R&D) Expenses Revenue Revenue Gross Profit
Market news
NasdaqGS: LRCX

Lam Research Corporation

CEO Mr. Timothy M. Archer
IPO Date May 4, 1984
Location United States
Headquarters 4650 Cushing Parkway
Employees 18,600
Sector 🤖 Technology
Industries
Steel
🖨 3D Printing
💻 Computers
🔌 Hardware & Electronics
💻 Semiconductors
Description

Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits. The company offers ALTUS systems to deposit conformal films for tungsten metallization applications; SABRE electrochemical deposition products for copper interconnect transition that offers copper damascene manufacturing; SOLA ultraviolet thermal processing products for film treatments; and VECTOR plasma-enhanced CVD ALD products. It also provides SPEED gapfill high-density plasma chemical vapor deposition products; and Striker single-wafer atomic layer deposition products for dielectric film solutions. In addition, the company offers Flex for dielectric etch applications; Kiyo for conductor etch applications; Syndion for through-silicon via etch applications; and Versys metal products for metal etch processes. Further, it provides Coronus bevel clean products to enhance die yield; Da Vinci, DV-Prime, EOS, and SP series products to address various wafer cleaning applications; and Metryx mass metrology systems for high precision in-line mass measurement in semiconductor wafer manufacturing. The company sells its products and services to semiconductors industry in the United States, China, Europe, Japan, Korea, Southeast Asia, Taiwan, and internationally. Lam Research Corporation was incorporated in 1980 and is headquartered in Fremont, California.

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