Aehr Test Systems

NASDAQ AEHR

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Aehr Test Systems Net Income for the Trailing 12 Months (TTM) ending February 29, 2024: USD 15.40 M

Aehr Test Systems Net Income is USD 15.40 M for the Trailing 12 Months (TTM) ending February 29, 2024, a 8.17% change year over year. Net Income is the profit earned by a company after deducting all expenses, including taxes and non-controlling interest.

Aehr Test Systems Net Income for the Trailing 12 Months (TTM) ending February 28, 2023 was USD 14.24 M, a 237.20% change year over year.
Aehr Test Systems Net Income for the Trailing 12 Months (TTM) ending February 28, 2022 was USD 4.22 M, a 177.08% change year over year.
Aehr Test Systems Net Income for the Trailing 12 Months (TTM) ending February 28, 2021 was USD -5.48 M, a -2,938.86% change year over year.
Aehr Test Systems Net Income for the Trailing 12 Months (TTM) ending February 29, 2020 was USD 193.00 K, a 103.74% change year over year.

NASDAQ: AEHR

Aehr Test Systems

CEO	Mr. Rhea J. Posedel
IPO Date	Aug. 14, 1997
Location	United States
Headquarters	400 Kato Terrace, Fremont, CA, United States, 94539
Employees	104
Sector	Technology
Industry	Semiconductor equipment & materials

Description

Aehr Test Systems provides test solutions for testing, burning-in, and semiconductor devices in wafer level, singulated die, and package part form, and installed systems worldwide. Its product portfolio includes FOX-XP and FOX-NP systems that are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize range of devices, including silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The company also offers FOX-CP system, a low-cost single-wafer compact test solution for logic, memory, and photonic devices; FOX WaferPak Contactor, a full wafer contactor capable of testing wafers up to 300mm that enables integrated circuit manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. In addition, it provides FOX DiePak Carrier, a reusable temporary package that enables IC manufacturers to perform final test and burn-in of bare die and modules; and FOX DiePak Loader. The company was incorporated in 1977 and is headquartered in Fremont, California.

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