Aehr Test Systems

NASDAQ AEHR

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Aehr Test Systems Gross Profit Margin for the Trailing 12 Months (TTM) ending February 29, 2024: 48.20%

Aehr Test Systems Gross Profit Margin is 48.20% for the Trailing 12 Months (TTM) ending February 29, 2024, a -2.90% change year over year. Gross Profit Margin represents the percentage of revenue that represents gross profit, indicating the efficiency of a company's production and pricing.

Aehr Test Systems Gross Profit Margin for the Trailing 12 Months (TTM) ending February 28, 2023 was 49.64%, a 13.11% change year over year.
Aehr Test Systems Gross Profit Margin for the Trailing 12 Months (TTM) ending February 28, 2022 was 43.89%, a 161.31% change year over year.
Aehr Test Systems Gross Profit Margin for the Trailing 12 Months (TTM) ending February 28, 2021 was 16.79%, a -63.34% change year over year.
Aehr Test Systems Gross Profit Margin for the Trailing 12 Months (TTM) ending February 29, 2020 was 45.81%, a 46.10% change year over year.

NASDAQ: AEHR

Aehr Test Systems

CEO	Mr. Rhea J. Posedel
IPO Date	Aug. 14, 1997
Location	United States
Headquarters	400 Kato Terrace, Fremont, CA, United States, 94539
Employees	104
Sector	Technology
Industry	Semiconductor equipment & materials

Description

Aehr Test Systems provides test solutions for testing, burning-in, and semiconductor devices in wafer level, singulated die, and package part form, and installed systems worldwide. Its product portfolio includes FOX-XP and FOX-NP systems that are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize range of devices, including silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The company also offers FOX-CP system, a low-cost single-wafer compact test solution for logic, memory, and photonic devices; FOX WaferPak Contactor, a full wafer contactor capable of testing wafers up to 300mm that enables integrated circuit manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. In addition, it provides FOX DiePak Carrier, a reusable temporary package that enables IC manufacturers to perform final test and burn-in of bare die and modules; and FOX DiePak Loader. The company was incorporated in 1977 and is headquartered in Fremont, California.

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