Aehr Test Systems

NASDAQ AEHR

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Aehr Test Systems Current Liabilities to Total Liabilities Ratio 3 year CAGR for the quarter ending February 29, 2024: -2.46%

Aehr Test Systems Current Liabilities to Total Liabilities Ratio 3 year CAGR is -2.46% for the quarter ending February 29, 2024, a -118.26% change year over year. The current liabilities to total liabilities ratio measures the proportion of a company's current liabilities in relation to its total liabilities. It is calculated by dividing current liabilities by total liabilities. This ratio provides insights into the percentage of a company's total liabilities that are classified as current liabilities. It helps evaluate the company's overall liability structure and the importance of short-term obligations in relation to total liabilities. CAGR, or the Compound Annual Growth Rate, quantifies the mean annual growth rate of an investment or financial metric over a specified time span, considering the influence of compounding. It is instrumental in determining the true annualized return on an investment.

Aehr Test Systems Current Liabilities to Total Liabilities Ratio for the quarter ending February 28, 2022 was 0.96, a 16.63% change year over year.
Aehr Test Systems Current Liabilities to Total Liabilities Ratio for the quarter ending February 28, 2021 was 0.82, a 26.84% change year over year.
Aehr Test Systems Current Liabilities to Total Liabilities Ratio for the quarter ending February 29, 2020 was 0.65, a -32.65% change year over year.

NASDAQ: AEHR

Aehr Test Systems

CEO	Mr. Rhea J. Posedel
IPO Date	Aug. 14, 1997
Location	United States
Headquarters	400 Kato Terrace, Fremont, CA, United States, 94539
Employees	104
Sector	Technology
Industry	Semiconductor equipment & materials

Description

Aehr Test Systems provides test solutions for testing, burning-in, and semiconductor devices in wafer level, singulated die, and package part form, and installed systems worldwide. Its product portfolio includes FOX-XP and FOX-NP systems that are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize range of devices, including silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The company also offers FOX-CP system, a low-cost single-wafer compact test solution for logic, memory, and photonic devices; FOX WaferPak Contactor, a full wafer contactor capable of testing wafers up to 300mm that enables integrated circuit manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. In addition, it provides FOX DiePak Carrier, a reusable temporary package that enables IC manufacturers to perform final test and burn-in of bare die and modules; and FOX DiePak Loader. The company was incorporated in 1977 and is headquartered in Fremont, California.

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