Aehr Test Systems

NASDAQ AEHR

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Aehr Test Systems Dividend Per Share 1 year YoY Change (%) for the Trailing 12 Months (TTM) ending September 20, 2024

Aehr Test Systems Dividend Per Share 1 year YoY Change (%) is NA for the Trailing 12 Months (TTM) ending September 20, 2024. The dividend per share represents the amount of dividends distributed to each outstanding share of common stock. It is calculated by dividing dividends paid by the weighted average number of shares outstanding. This metric provides insight into the dividend distribution on a per-share basis and is commonly used by investors to assess the dividend yield. The measure "Change (%)" refers to the percentage change in the value of a financial metric between two time points. This measure provides a relative perspective on the magnitude of change.

NASDAQ: AEHR

Aehr Test Systems

CEO	Mr. Rhea J. Posedel
IPO Date	Aug. 14, 1997
Location	United States
Headquarters	400 Kato Terrace, Fremont, CA, United States, 94539
Employees	104
Sector	Technology
Industry	Semiconductor equipment & materials

Description

Aehr Test Systems provides test solutions for testing, burning-in, and semiconductor devices in wafer level, singulated die, and package part form, and installed systems worldwide. Its product portfolio includes FOX-XP and FOX-NP systems that are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize range of devices, including silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The company also offers FOX-CP system, a low-cost single-wafer compact test solution for logic, memory, and photonic devices; FOX WaferPak Contactor, a full wafer contactor capable of testing wafers up to 300mm that enables integrated circuit manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. In addition, it provides FOX DiePak Carrier, a reusable temporary package that enables IC manufacturers to perform final test and burn-in of bare die and modules; and FOX DiePak Loader. The company was incorporated in 1977 and is headquartered in Fremont, California.

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