Amtech Systems Inc

NASDAQ ASYS

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Amtech Systems Inc Debt to Tangible Net Worth Ratio 1 year YoY Change (%) for the quarter ending September 30, 2023: 767.57%

Amtech Systems Inc Debt to Tangible Net Worth Ratio 1 year YoY Change (%) is 767.57% for the quarter ending September 30, 2023, a 1,354.14% change year over year. The debt to tangible net worth ratio measures the level of debt relative to a company's tangible net worth. It is calculated by dividing total debt by the difference between shareholders' equity and intangible assets (such as goodwill). This ratio provides insights into the company's financial leverage, excluding intangible assets. A higher ratio suggests a higher level of debt burden in relation to tangible net worth. The measure "Change (%)" refers to the percentage change in the value of a financial metric between two time points. This measure provides a relative perspective on the magnitude of change.
  • Amtech Systems Inc Debt to Tangible Net Worth Ratio for the quarter ending March 31, 2023 was 0.25, a 251.54% change year over year.
  • Amtech Systems Inc Debt to Tangible Net Worth Ratio for the quarter ending March 31, 2022 was 0.07, a 0.94% change year over year.
  • Amtech Systems Inc Debt to Tangible Net Worth Ratio for the quarter ending March 31, 2021 was 0.07, a -2.50% change year over year.
  • Amtech Systems Inc Debt to Tangible Net Worth Ratio for the quarter ending March 31, 2020 was 0.07, a -3.37% change year over year.
NASDAQ: ASYS

Amtech Systems Inc

CEO Mr. Michael Whang
IPO Date Sept. 7, 1984
Location United States
Headquarters 131 South Clark Drive, Tempe, AZ, United States, 85288
Employees 405
Sector Technology
Industry Semiconductor equipment & materials
Description

Amtech Systems, Inc. manufactures and sells capital equipment and related consumables for use in fabricating silicon carbide (SiC), silicon power devices, analog and discrete devices, electronic assemblies, and light-emitting diodes (LEDs) worldwide. The company operates through Semiconductor and Material and Substrate segments. The Semiconductor segment designs, manufactures, sells, and services thermal processing equipment, including solder reflow ovens, horizontal diffusion furnaces, and custom high-temp belt furnaces for use by semiconductor, electronics, and electro/mechanical assembly manufacturers; and diffusion and reflow thermal systems, as well as wafer cleaning equipment and related services. The Material and Substrate segment manufactures and sells consumables and machinery for lapping and polishing of materials, such as silicon wafers for semiconductor products; sapphire substrates for LED lighting and mobile devices; silicon carbide wafers for LED and power device applications; various glass and silica components for 3D image transmission; quartz and ceramic components for telecommunications devices; and medical device components, and optical and photonics applications. It also offers substrate products comprising of double-sided wafer cleaning system, entegrity head tester, substrate carrier, substrate polishing templates, double-sided lapping and polishing machines, single-sided polisher, and substrate process chemicals. The company sells its products through sales personnel, as well as a network of independent sales representatives and distributors. Amtech Systems, Inc. was incorporated in 1981 and is headquartered in Tempe, Arizona.

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StockViz Staff

September 19, 2024

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