Lam Research Corp

NASDAQ LRCX

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Lam Research Corp Cash Flow Coverage Ratio 5 year CAGR for the quarter ending March 31, 2024: 0.04%

Lam Research Corp Cash Flow Coverage Ratio 5 year CAGR is 0.04% for the quarter ending March 31, 2024. The cash flow coverage ratio evaluates a company's ability to cover its interest expense with its operating cash flow after deducting capital expenditures. It is calculated by dividing the difference between operating cash flow and capital expenditures by interest expense. This ratio indicates the company's ability to generate enough cash flow to service its interest payments. A higher ratio signifies better coverage and financial stability. CAGR, or the Compound Annual Growth Rate, quantifies the mean annual growth rate of an investment or financial metric over a specified time span, considering the influence of compounding. It is instrumental in determining the true annualized return on an investment.
  • Lam Research Corp Cash Flow Coverage Ratio for the quarter ending March 31, 2023 was 19.10, a 45.68% change year over year.
  • Lam Research Corp Cash Flow Coverage Ratio for the quarter ending March 31, 2022 was 13.11, a -36.33% change year over year.
  • Lam Research Corp Cash Flow Coverage Ratio for the quarter ending March 31, 2021 was 20.59, a 74.69% change year over year.
  • Lam Research Corp Cash Flow Coverage Ratio for the quarter ending March 31, 2020 was 11.79, a -58.40% change year over year.
NASDAQ: LRCX

Lam Research Corp

CEO Mr. Timothy M. Archer
IPO Date May 11, 1984
Location United States
Headquarters 4650 Cushing Parkway, Fremont, CA, United States, 94538
Employees 17,200
Sector Technology
Industry Semiconductor equipment & materials
Description

Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits. The company offers ALTUS systems to deposit conformal films for tungsten metallization applications; SABRE electrochemical deposition products for copper interconnect transition that offers copper damascene manufacturing; SOLA ultraviolet thermal processing products for film treatments; and VECTOR plasma-enhanced CVD ALD products. It also provides SPEED gapfill high-density plasma chemical vapor deposition products; and Striker single-wafer atomic layer deposition products for dielectric film solutions. In addition, the company offers Flex for dielectric etch applications; Kiyo for conductor etch applications; Syndion for through-silicon via etch applications; and Versys metal products for metal etch processes. Further, it provides Coronus bevel clean products to enhance die yield; Da Vinci, DV-Prime, EOS, and SP series products to address various wafer cleaning applications; and Metryx mass metrology systems for high precision in-line mass measurement in semiconductor wafer manufacturing. The company sells its products and services to semiconductors industry in the United States, China, Europe, Japan, Korea, Southeast Asia, Taiwan, and internationally. The company was incorporated in 1980 and is headquartered in Fremont, California.

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StockViz Staff

September 20, 2024

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