Lam Research Corp

NASDAQ LRCX

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Lam Research Corp Cash Interest Coverage Ratio for the Trailing 12 Months (TTM) ending March 31, 2024: 29.37

Lam Research Corp Cash Interest Coverage Ratio is 29.37 for the Trailing 12 Months (TTM) ending March 31, 2024, a 46.14% change year over year. The cash interest coverage ratio measures a company's ability to cover its interest expenses with its operating cash flow. It is calculated by dividing operating cash flow by interest expense. This ratio indicates the company's capacity to generate sufficient cash flow to meet its interest obligations. A higher ratio signifies better coverage and financial stability.

Lam Research Corp Cash Interest Coverage Ratio for the Trailing 12 Months (TTM) ending March 31, 2023 was 20.10, a -5.38% change year over year.
Lam Research Corp Cash Interest Coverage Ratio for the Trailing 12 Months (TTM) ending March 31, 2022 was 21.24, a 47.24% change year over year.
Lam Research Corp Cash Interest Coverage Ratio for the Trailing 12 Months (TTM) ending March 31, 2021 was 14.42, a 14.99% change year over year.
Lam Research Corp Cash Interest Coverage Ratio for the Trailing 12 Months (TTM) ending March 31, 2020 was 12.54, a -60.10% change year over year.

NASDAQ: LRCX

Lam Research Corp

CEO	Mr. Timothy M. Archer
IPO Date	May 11, 1984
Location	United States
Headquarters	4650 Cushing Parkway, Fremont, CA, United States, 94538
Employees	17,200
Sector	Technology
Industry	Semiconductor equipment & materials

Description

Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits. The company offers ALTUS systems to deposit conformal films for tungsten metallization applications; SABRE electrochemical deposition products for copper interconnect transition that offers copper damascene manufacturing; SOLA ultraviolet thermal processing products for film treatments; and VECTOR plasma-enhanced CVD ALD products. It also provides SPEED gapfill high-density plasma chemical vapor deposition products; and Striker single-wafer atomic layer deposition products for dielectric film solutions. In addition, the company offers Flex for dielectric etch applications; Kiyo for conductor etch applications; Syndion for through-silicon via etch applications; and Versys metal products for metal etch processes. Further, it provides Coronus bevel clean products to enhance die yield; Da Vinci, DV-Prime, EOS, and SP series products to address various wafer cleaning applications; and Metryx mass metrology systems for high precision in-line mass measurement in semiconductor wafer manufacturing. The company sells its products and services to semiconductors industry in the United States, China, Europe, Japan, Korea, Southeast Asia, Taiwan, and internationally. The company was incorporated in 1980 and is headquartered in Fremont, California.

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