Lam Research Corp

NASDAQ LRCX

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Lam Research Corp Current Liabilities to Total Liabilities Ratio 3 year CAGR for the year ending June 30, 2023: 5.48%

Lam Research Corp Current Liabilities to Total Liabilities Ratio 3 year CAGR is 5.48% for the year ending June 30, 2023, a -36.74% change year over year. The current liabilities to total liabilities ratio measures the proportion of a company's current liabilities in relation to its total liabilities. It is calculated by dividing current liabilities by total liabilities. This ratio provides insights into the percentage of a company's total liabilities that are classified as current liabilities. It helps evaluate the company's overall liability structure and the importance of short-term obligations in relation to total liabilities. CAGR, or the Compound Annual Growth Rate, quantifies the mean annual growth rate of an investment or financial metric over a specified time span, considering the influence of compounding. It is instrumental in determining the true annualized return on an investment.

Lam Research Corp Current Liabilities to Total Liabilities Ratio for the year ending June 30, 2022 was 0.42, a 16.92% change year over year.
Lam Research Corp Current Liabilities to Total Liabilities Ratio for the year ending June 30, 2021 was 0.36, a 6.02% change year over year.
Lam Research Corp Current Liabilities to Total Liabilities Ratio for the year ending June 30, 2020 was 0.34, a 3.51% change year over year.
Lam Research Corp Current Liabilities to Total Liabilities Ratio for the year ending June 30, 2019 was 0.33, a -38.98% change year over year.

NASDAQ: LRCX

Lam Research Corp

CEO	Mr. Timothy M. Archer
IPO Date	May 11, 1984
Location	United States
Headquarters	4650 Cushing Parkway, Fremont, CA, United States, 94538
Employees	17,200
Sector	Technology
Industry	Semiconductor equipment & materials

Description

Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits. The company offers ALTUS systems to deposit conformal films for tungsten metallization applications; SABRE electrochemical deposition products for copper interconnect transition that offers copper damascene manufacturing; SOLA ultraviolet thermal processing products for film treatments; and VECTOR plasma-enhanced CVD ALD products. It also provides SPEED gapfill high-density plasma chemical vapor deposition products; and Striker single-wafer atomic layer deposition products for dielectric film solutions. In addition, the company offers Flex for dielectric etch applications; Kiyo for conductor etch applications; Syndion for through-silicon via etch applications; and Versys metal products for metal etch processes. Further, it provides Coronus bevel clean products to enhance die yield; Da Vinci, DV-Prime, EOS, and SP series products to address various wafer cleaning applications; and Metryx mass metrology systems for high precision in-line mass measurement in semiconductor wafer manufacturing. The company sells its products and services to semiconductors industry in the United States, China, Europe, Japan, Korea, Southeast Asia, Taiwan, and internationally. The company was incorporated in 1980 and is headquartered in Fremont, California.

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