Teradyne Inc

NASDAQ TER

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Teradyne Inc Current Liabilities to Total Liabilities Ratio 3 year CAGR for the Trailing 12 Months (TTM) ending March 31, 2024: 10.22%

Teradyne Inc Current Liabilities to Total Liabilities Ratio 3 year CAGR is 10.22% for the Trailing 12 Months (TTM) ending March 31, 2024, a -45.63% change year over year. The current liabilities to total liabilities ratio measures the proportion of a company's current liabilities in relation to its total liabilities. It is calculated by dividing current liabilities by total liabilities. This ratio provides insights into the percentage of a company's total liabilities that are classified as current liabilities. It helps evaluate the company's overall liability structure and the importance of short-term obligations in relation to total liabilities. CAGR, or the Compound Annual Growth Rate, quantifies the mean annual growth rate of an investment or financial metric over a specified time span, considering the influence of compounding. It is instrumental in determining the true annualized return on an investment.

Teradyne Inc Current Liabilities to Total Liabilities Ratio for the Trailing 12 Months (TTM) ending March 31, 2023 was 0.68, a 6.66% change year over year.
Teradyne Inc Current Liabilities to Total Liabilities Ratio for the Trailing 12 Months (TTM) ending March 31, 2022 was 0.63, a 31.69% change year over year.
Teradyne Inc Current Liabilities to Total Liabilities Ratio for the Trailing 12 Months (TTM) ending March 31, 2021 was 0.48, a 19.38% change year over year.
Teradyne Inc Current Liabilities to Total Liabilities Ratio for the Trailing 12 Months (TTM) ending March 31, 2020 was 0.40, a 4.56% change year over year.

NASDAQ: TER

Teradyne Inc

CEO	Mr. Mark E. Jagiela
IPO Date	March 11, 1987
Location	United States
Headquarters	600 Riverpark Drive, North Reading, MA, United States, 01864
Employees	6,600
Sector	Technology
Industry	Semiconductor equipment & materials

Description

Teradyne, Inc. designs, develops, manufactures, and sells automated test systems and robotics products worldwide. It operates through four segments; Semiconductor Test, System Test, Robotics, and Wireless Test. The Semiconductor Test segment offers products and services for wafer level and device package testing of semiconductor devices in automotive, industrial, communications, consumer, smartphones, cloud, computer and electronic game, and other applications. This segment also provides FLEX test platform systems; J750 test system to address the volume semiconductor devices, including microcontrollers; Magnum platform that tests memory devices, such as flash memory and DRAM; and ETS platform for semiconductor manufacturers, and assembly and test subcontractors in the analog/mixed signal markets. It serves integrated device manufacturers that integrate the fabrication of silicon wafers into their business; fabless companies that outsource the manufacturing of silicon wafers; foundries; and semiconductor assembly and test providers. The System Test segment offers defense/aerospace test instrumentation and systems; storage and system level test systems; and circuit-board test and inspection systems. The Wireless Test segment provides wireless test solutions for silicon validation, wireless module manufacturing, and wireless end device manufacturing under the LitePoint brand. This segment also offers IQxel-MX and IQxel-MW7G series products for edge measurement performance in the manufacturing of connectivity products; IQxstream-5G and IQgig-5G family products to support 4G and 5G technologies; and IQgig-UWB+ for certification and manufacturing test support for ultra wideband products. The Robotics segment provides collaborative robotic arms, autonomous mobile robots, and advanced robotic control software for manufacturing, logistics, and industrial customers. The company was incorporated in 1960 and is headquartered in North Reading, Massachusetts.

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