Teradyne Inc

NASDAQ TER

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Teradyne Inc Debt to Tangible Net Worth Ratio 1 year YoY Change (%) for the Trailing 12 Months (TTM) ending June 30, 2023: -28.65%

Teradyne Inc Debt to Tangible Net Worth Ratio 1 year YoY Change (%) is -28.65% for the Trailing 12 Months (TTM) ending June 30, 2023, a 61.20% change year over year. The debt to tangible net worth ratio measures the level of debt relative to a company's tangible net worth. It is calculated by dividing total debt by the difference between shareholders' equity and intangible assets (such as goodwill). This ratio provides insights into the company's financial leverage, excluding intangible assets. A higher ratio suggests a higher level of debt burden in relation to tangible net worth. The measure "Change (%)" refers to the percentage change in the value of a financial metric between two time points. This measure provides a relative perspective on the magnitude of change.

Teradyne Inc Debt to Tangible Net Worth Ratio for the Trailing 12 Months (TTM) ending March 31, 2023 was 0.05, a -51.76% change year over year.
Teradyne Inc Debt to Tangible Net Worth Ratio for the Trailing 12 Months (TTM) ending March 31, 2022 was 0.10, a -64.73% change year over year.
Teradyne Inc Debt to Tangible Net Worth Ratio for the Trailing 12 Months (TTM) ending March 31, 2021 was 0.28, a -32.58% change year over year.
Teradyne Inc Debt to Tangible Net Worth Ratio for the Trailing 12 Months (TTM) ending March 31, 2020 was 0.41, a -20.65% change year over year.

NASDAQ: TER

Teradyne Inc

CEO	Mr. Mark E. Jagiela
IPO Date	March 11, 1987
Location	United States
Headquarters	600 Riverpark Drive, North Reading, MA, United States, 01864
Employees	6,600
Sector	Technology
Industry	Semiconductor equipment & materials

Description

Teradyne, Inc. designs, develops, manufactures, and sells automated test systems and robotics products worldwide. It operates through four segments; Semiconductor Test, System Test, Robotics, and Wireless Test. The Semiconductor Test segment offers products and services for wafer level and device package testing of semiconductor devices in automotive, industrial, communications, consumer, smartphones, cloud, computer and electronic game, and other applications. This segment also provides FLEX test platform systems; J750 test system to address the volume semiconductor devices, including microcontrollers; Magnum platform that tests memory devices, such as flash memory and DRAM; and ETS platform for semiconductor manufacturers, and assembly and test subcontractors in the analog/mixed signal markets. It serves integrated device manufacturers that integrate the fabrication of silicon wafers into their business; fabless companies that outsource the manufacturing of silicon wafers; foundries; and semiconductor assembly and test providers. The System Test segment offers defense/aerospace test instrumentation and systems; storage and system level test systems; and circuit-board test and inspection systems. The Wireless Test segment provides wireless test solutions for silicon validation, wireless module manufacturing, and wireless end device manufacturing under the LitePoint brand. This segment also offers IQxel-MX and IQxel-MW7G series products for edge measurement performance in the manufacturing of connectivity products; IQxstream-5G and IQgig-5G family products to support 4G and 5G technologies; and IQgig-UWB+ for certification and manufacturing test support for ultra wideband products. The Robotics segment provides collaborative robotic arms, autonomous mobile robots, and advanced robotic control software for manufacturing, logistics, and industrial customers. The company was incorporated in 1960 and is headquartered in North Reading, Massachusetts.

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