HANMI Semiconductor Co., Ltd.

KSE:042700.KS

Sector

🤖 Technology

Industries

🖨 3D Printing

🚗 Automotive Parts

🔌 Hardware & Electronics

🔩 Machinery

💻 Semiconductors

Location

South Korea

Market Cap

USD 7.16 B

Share Price

USD 76.12

Avg Daily Volume

1,146,468

Change (1 day)

6.79%

Change (1 year)

-40.79%

Change (YTD)

36.48%

HANMI Semiconductor Co., Ltd. Shareholders' Equity for the year ending December 31, 2024: USD 364.02 M

HANMI Semiconductor Co., Ltd. Shareholders' Equity is USD 364.02 M for the year ending December 31, 2024, a -17.12% change year over year. Shareholders' equity are the residual interest in the assets of a company after deducting liabilities, representing the shareholders' ownership claim.

HANMI Semiconductor Co., Ltd. Shareholders' Equity for the year ending December 31, 2023 was USD 439.22 M, a 42.52% change year over year.
HANMI Semiconductor Co., Ltd. Shareholders' Equity for the year ending December 31, 2022 was USD 308.18 M, a 6.16% change year over year.
HANMI Semiconductor Co., Ltd. Shareholders' Equity for the year ending December 31, 2021 was USD 290.28 M, a 23.00% change year over year.
HANMI Semiconductor Co., Ltd. Shareholders' Equity for the year ending December 31, 2020 was USD 236.01 M, a 24.62% change year over year.

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Key data

Date	Shareholders' Equity	Cash and Short-Term Investments	Receivables	Inventory

KSE: 042700.KS

HANMI Semiconductor Co., Ltd.

CEO	Mr. Dong-Shin Kwak
IPO Date	July 25, 2005
Location	South Korea
Headquarters	532-2, Gajwa-Dong
Employees	674
Sector	🤖 Technology
Industries 3D Printing 🚗 Automotive Parts 🔌 Hardware & Electronics 🔩 Machinery 💻 Semiconductors

Description

HANMI Semiconductor Co., Ltd. manufactures and sells semiconductor equipment in South Korea and internationally. The company offers vision placement equipment; flip chip, TSV dual stacking, TC, flip chip, jumbo panel flip chip, and die flip chip bonders; and EMI shield vision attach and detach, EMI shield vision placement, EMI shield tape mounter, EMI shield tape laser cutting, EMI shield tape demounter, vision inspection, and converlay attach equipment. It also provides power ECU auto, test handler, vision placement, trim, and form/singulation devices, as well as 3D vision inspection equipment; auto mold, compression auto mold, mechanical mold press, and hydraulic mold press equipment; laser marking, laser wafer marking, laser ablation, laser cutting, and laser cutting/deflash equipment. In addition, the company offers cam press trim and form, micro cam press, CSP singulation, pick and place, die soater, strip mounter, and test equipment. HANMI Semiconductor Co., Ltd. was founded in 1980 and is based in Incheon, South Korea.