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ASE Technology Holding Co., Ltd.

Taiwan Stock Exchange:3711.TW

Location

Taiwan

Market Cap

USD 22.38 B

Share Price

USD 5.15

Avg Daily Volume

12,373,011

Change (1 day)

-1.53%

Change (1 year)

-2.61%

Change (YTD)

4.37%

ASE Technology Holding Co., Ltd. Shareholders' Equity for the year ending December 31, 2024: USD 9.75 B

ASE Technology Holding Co., Ltd. Shareholders' Equity is USD 9.75 B for the year ending December 31, 2024, a 0.46% change year over year. Shareholders' equity are the residual interest in the assets of a company after deducting liabilities, representing the shareholders' ownership claim.
  • ASE Technology Holding Co., Ltd. Shareholders' Equity for the year ending December 31, 2023 was USD 9.70 B, a -1.29% change year over year.
  • ASE Technology Holding Co., Ltd. Shareholders' Equity for the year ending December 31, 2022 was USD 9.83 B, a 4.76% change year over year.
  • ASE Technology Holding Co., Ltd. Shareholders' Equity for the year ending December 31, 2021 was USD 9.38 B, a 20.70% change year over year.
  • ASE Technology Holding Co., Ltd. Shareholders' Equity for the year ending December 31, 2020 was USD 7.77 B, a 15.70% change year over year.
Key data
Date Shareholders' Equity Cash and Short-Term Investments Receivables Inventory
Market news
Taiwan Stock Exchange: 3711.TW

ASE Technology Holding Co., Ltd.

CEO Mr. Hung-Pen Chang
IPO Date Jan. 4, 2000
Location Taiwan
Headquarters 26, Chin 3rd Road
Employees 96,436
Sector 🤖 Technology
Industries
Hardware & Electronics
🖨 3D Printing
💻 Computers
📦 Containers & Packaging
💻 Semiconductors
Description

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

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