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BE Semiconductor Industries N.V.

Amsterdam Stock Exchange:BESI.AS

Location

Netherlands

Market Cap

USD 11.29 B

Share Price

USD 141.88

Avg Daily Volume

536,403

Change (1 day)

-1.01%

Change (1 year)

-15.39%

Change (YTD)

3.57%

BE Semiconductor Industries N.V. Shareholders' Equity for the year ending December 31, 2024: USD 519.05 M

BE Semiconductor Industries N.V. Shareholders' Equity is USD 519.05 M for the year ending December 31, 2024, a 11.59% change year over year. Shareholders' equity are the residual interest in the assets of a company after deducting liabilities, representing the shareholders' ownership claim.
  • BE Semiconductor Industries N.V. Shareholders' Equity for the year ending December 31, 2023 was USD 465.13 M, a -30.83% change year over year.
  • BE Semiconductor Industries N.V. Shareholders' Equity for the year ending December 31, 2022 was USD 672.49 M, a -4.60% change year over year.
  • BE Semiconductor Industries N.V. Shareholders' Equity for the year ending December 31, 2021 was USD 704.95 M, a 55.45% change year over year.
  • BE Semiconductor Industries N.V. Shareholders' Equity for the year ending December 31, 2020 was USD 453.48 M, a 35.37% change year over year.
Key data
Date Shareholders' Equity Cash and Short-Term Investments Receivables Inventory
Market news
Amsterdam Stock Exchange: BESI.AS

BE Semiconductor Industries N.V.

CEO Mr. Richard W. Blickman
IPO Date July 20, 1998
Location Netherlands
Headquarters Ratio 6
Employees 1,820
Sector 🤖 Technology
Industries
Hardware & Electronics
🖨 3D Printing
💻 Computers
💻 Semiconductors
🏗️ Steel
Description

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include die attach equipment, such as single chip, multi chip, multi module, flip chip, thermal compression bonding, fan out wafer level packaging, hybrid and embedded bridge die bonding, and die sorting systems; and packaging equipment, including conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment comprising tin, copper, and precious metal and solar plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company's principal brand names include Datacon, Esec, Fico, and Meco. It offers its products primarily to multinational chip manufacturers, assembly subcontractors, and electronics and industrial companies. The company was incorporated in 1995 and is headquartered in Duiven, the Netherlands.

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